Inventor · disambiguated record
Masahiro Izumi
Also filed as: IZUMI MASAHIRO
38 granted patents·11 pending applications·479 citations·filing 1983–2019
98Inventor score
Files withMITSUI HIGH TEC12TOSHIBA LIGHTING & TECHNOLOGY11SANPEI TOMOHIRO4HONDA MOTOR CO LTD3SONY CORP3
Top patents by PatentIndex Score
49 records- 0197US10348170B2Method for manufacturing a segmented laminated coreMITSUI HIGH TEC·Filed 2016·Granted Jul 9, 2019·20 cites·5 claims
- 0297US7690817B2Illumination device with semiconductor light-emitting elementsTOSHIBA LIGHTING & TECHNOLOGY·Filed 2007·Granted Apr 6, 2010·111 cites·15 claims
- 0393US7934856B2Illumination device with semiconductor light-emitting elementsTOSHIBA LIGHTING & TECHNOLOGY·Filed 2010·Granted May 3, 2011·16 cites·22 claims
- 0491US5836061ACable end anchoring nipple and methods of constructing and utilizing sameHONDA MOTOR CO LTD·Filed 1997·Granted Nov 17, 1998·48 cites·19 claims
- 0589US10033232B2Laminate and method for manufacturing the same and method for manufacturing laminated coreMITSUI HIGH TEC·Filed 2015·Granted Jul 24, 2018·4 cites·18 claims
- 0689US7989840B2Illumination apparatus having a plurality of semiconductor light-emitting devicesTOSHIBA LIGHTING & TECHNOLOGY·Filed 2007·Granted Aug 2, 2011·17 cites·16 claims
- 0788US8167456B2Illumination device with semiconductor light-emitting elementsSANPEI TOMOHIRO·Filed 2011·Granted May 1, 2012·8 cites·10 claims
- 0887US6797367B2Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring boardSONY CORP·Filed 2003·Granted Sep 28, 2004·37 cites·5 claims
- 0985US10784732B2Method of punching a core piece having a bridgeMITSUI HIGH TEC·Filed 2018·Granted Sep 22, 2020·2 cites·9 claims
- 1085US10630153B2Laminated core and method for manufacturing sameMITSUI HIGH TEC·Filed 2015·Granted Apr 21, 2020·3 cites·19 claims
- 1183US10252318B2Die apparatus and method for blanking thin plateMITSUI HIGH TEC·Filed 2016·Granted Apr 9, 2019·3 cites·12 claims
- 1283US9948153B2Stacked core having a plurality of core pieces and a bridge portionMITSUI HIGH TEC·Filed 2015·Granted Apr 17, 2018·4 cites·3 claims
- 1380USD658599SLight emitting diode moduleTAKAHASHI AKIMICHI·Filed 2010·Granted May 1, 2012·27 cites·1 claims
- 1479US8894254B2Luminaire and lamp apparatus housingMATSUDA RYOTARO·Filed 2012·Granted Nov 25, 2014·7 cites·10 claims
- 1578US7753974B2Polishing composition for semiconductor wafer, method for production thereof and polishing methodNIPPON CHEMICAL IND·Filed 2008·Granted Jul 13, 2010·6 cites·7 claims
- 1676US8398267B2Illumination device with semiconductor light-emitting elementsSANPEI TOMOHIRO·Filed 2012·Granted Mar 19, 2013·3 cites·7 claims
- 1776US7053554B2Bulb-shaped fluorescent lamp and illumination deviceTOSHIBA LIGHTING & TECHNOLOGY·Filed 2003·Granted May 30, 2006·12 cites·39 claims
- 1874US8114178B2Polishing composition for semiconductor wafer and polishing methodIZUMI MASAHIRO·Filed 2008·Granted Feb 14, 2012·7 cites·10 claims
- 1973US7592742B2Fluorescent lamp, bulb-shaped fluorescent lamp, and lighting apparatusTOSHIBA LIGHTING & TECHNOLOGY·Filed 2005·Granted Sep 22, 2009·3 cites·3 claims
- 2073US5181491AIntake system in multi-cylinder type internal combustion engineHONDA MOTOR CO LTD·Filed 1992·Granted Jan 26, 1993·34 cites·12 claims
- 2170US7022399B2Semiconductor device integrated multilayer wiring boardMITSUBISHI PLASTICS INC·Filed 2003·Granted Apr 4, 2006·19 cites·7 claims
- 2268USD665518SLight emitting diode moduleTAKAHASHI AKIMICHI·Filed 2010·Granted Aug 14, 2012·16 cites·1 claims
- 2368US5921143ACoupling device for a sheathed cable and methods of constructing and utilizing sameHONDA MOTOR CO LTD·Filed 1997·Granted Jul 13, 1999·24 cites·24 claims
- 2465US6657389B2Glow discharge lamp, electrode thereof and luminaireTOSHIBA LIGHTING & TECHNOLOGY·Filed 2002·Granted Dec 2, 2003·6 cites·19 claims
- 2563US7334324B2Method of manufacturing multilayer wiring boardSONY CORP·Filed 2004·Granted Feb 26, 2008·8 cites·3 claims
- 2661US8558272B2Illumination apparatus having a plurality of semiconductor light-emitting devicesSANPEI TOMOHIRO·Filed 2011·Granted Oct 15, 2013·1 cites·5 claims
- 2761US8368113B2Light emitting device and lighting apparatusTOSHIBA LIGHTING & TECHNOLOGY·Filed 2011·Granted Feb 5, 2013·1 cites·2 claims
- 2860US10751782B2Method for processing laminated materialMITSUI HIGH TEC INC·Filed 2016·Granted Aug 25, 2020·0 cites·12 claims
- 2960US8569786B2Light emitting device and illumination deviceTAKEI HARUKI·Filed 2011·Granted Oct 29, 2013·2 cites·3 claims
- 3060US8098003B2Light emitting module and illumination deviceMORIKAWA KAZUTO·Filed 2010·Granted Jan 17, 2012·2 cites·10 claims
- 3159US5278422ANormally open solid state relay with minimized response time of relay action upon being turned offMATSUSHITA ELECTRIC WORKS LTD·Filed 1992·Granted Jan 11, 1994·16 cites·3 claims
- 3254US10128726B2Method for manufacturing a laminate and method for manufacturing a rotorMITSUI HIGH TEC·Filed 2015·Granted Nov 13, 2018·0 cites·11 claims
- 3353US8773612B2Light emitting module and illumination apparatusSANPEI TOMOHIRO·Filed 2010·Granted Jul 8, 2014·2 cites·12 claims
- 3452US2014322841A1Light emitting element module substrate, light emitting element module, and illuminating deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 3548US11472169B2Metal laminate and manufacturing method of metal laminateMITSUI HIGH TEC·Filed 2019·Granted Oct 18, 2022·0 cites·3 claims
- 3647US2009253813A1Colloidal silica consisting of silica particles fixing nitrogen contained alkaline compoundISHIGURI YUKO·Filed 2009·Application pending·0 cites
- 3747US2008116611A1Method of Manufacturing Multilayer Wiring BoardSONY CORP·Filed 2007·Application pending·0 cites
- 3846US2013037834A1Light emitting element module substrate, light emitting element module, and illuminating deviceTOSHIBA LIGHTING & TECHNOLOGY·Filed 2011·Application pending·0 cites
- 3945US10476339B2Armature and method for producing armatureMITSUI HIGH TEC·Filed 2016·Granted Nov 12, 2019·0 cites·8 claims
- 4045US4605917ACoil wireNEC CORP·Filed 1983·Granted Aug 12, 1986·10 cites·14 claims
- 4144US2009223136A1Polishing compound for semiconductor wafer polishing and polishing methodSPEEDFAM CO LTD 50·Filed 2008·Application pending·0 cites
- 4243US2014317908A1Method for manufacturing laminated iron core and shape of scrap produced therebyMITSUI HIGH TEC·Filed 2012·Application pending·0 cites
- 4342US2010163786A1Polishing composition for semiconductor waferIZUMI MASAHIRO·Filed 2009·Application pending·0 cites
- 4441US2008038996A1Polishing composition for semiconductor wafer, production method thereof, and polishing methodNIPPON CHEMICAL IND·Filed 2007·Application pending·0 cites
- 4540US2005062423A1Fluorescent lamp and lighting appliance using thereofTOSHIBA LIGHTING & TECHNOLOGY·Filed 2004·Application pending·0 cites
- 4639US2008191620A1Light Emitting Device and Illuminating DeviceTOSHIBA LIGHTING & TECHNOLOGY·Filed 2005·Application pending·0 cites
- 4738US10284062B2Method for manufacturing workpiece and method for manufacturing laminated coreMITSUI HIGH TEC·Filed 2016·Granted May 7, 2019·0 cites·8 claims
- 4837US2005062397A1Fluorescent lamp and lighting deviceTOSHIBA LIGHTING & TECHNOLOGY·Filed 2004·Application pending·0 cites
- 4933US10118212B2Method for forming blanked piece and manufacturing method of laminated body and laminated iron core using blanked piece formed by method for forming blanked pieceMITSUI HIGH TEC·Filed 2016·Granted Nov 6, 2018·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →