Inventor · disambiguated record
Mark P. Jamieson
Also filed as: JAMIESON MARK P
5 granted patents·239 citations·filing 1997–2001
81Inventor score
Top patents by PatentIndex Score
5 records- 0194US6545351B1Underside heat slug for ball grid array packagesINTEL CORP·Filed 2000·Granted Apr 8, 2003·120 cites·44 claims
- 0288US6060777AUnderside heat slug for ball grid array packagesINTEL CORP·Filed 1998·Granted May 9, 2000·102 cites·10 claims
- 0353US6310298B1Printed circuit board substrate having solder mask-free edgesINTEL CORP·Filed 1997·Granted Oct 30, 2001·17 cites·8 claims
- 0437US6564452B2Method for creating printed circuit board substrates having solder mask-free edgesINTEL CORP·Filed 2001·Granted May 20, 2003·0 cites·15 claims
- 0527US8125087B2High-density flip-chip interconnectJAMIESON MARK P·Filed 2001·Granted Feb 28, 2012·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →