Inventor · disambiguated record
Maximilian Kaeser
Also filed as: KAESER MAXIMILIAN
3 granted patents·14 citations·filing 1997–2011
62Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0155US6554686B1Sawing wire and method for the cutting and lapping of hard brittle workpiecesWACKER SILTRONIC HALBLEITERMAT·Filed 2000·Granted Apr 29, 2003·8 cites·6 claims
- 0232US5947102AMethod for cutting wafers from a crystalWACKER SILTRONIC HALBLEITERMAT·Filed 1997·Granted Sep 7, 1999·6 cites·7 claims
- 0330US8844511B2Method for slicing a multiplicity of wafers from a crystal composed of semiconductor materialKAESER MAXIMILIAN·Filed 2011·Granted Sep 30, 2014·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →