Inventor · disambiguated record
Masato Kajinami
Also filed as: KAJINAMI MASATO
10 granted patents·5 pending applications·3 citations·filing 2014–2025
78Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15
Top patents by PatentIndex Score
15 records- 0165US10823682B2Water measurement apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 3, 2020·1 cites·20 claims
- 0263US12500107B2Mounting device and mounting methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 0358US9726204B2Fluid pressure actuatorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 8, 2017·1 cites·19 claims
- 0456US9508577B2Semiconductor manufacturing apparatuses comprising bonding headsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 29, 2016·1 cites·3 claims
- 0555US2025308957A1Semiconductor bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0653US12444625B2Chip peeling apparatus and chip peeling method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·16 claims
- 0751US2024186278A1Mounting device and mounting methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0849US11314073B2Lighting device and inspection apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 26, 2022·0 cites·18 claims
- 0944US12051604B2Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 1044US2022139755A1Semiconductor manufacturing apparatus and chip handling methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1143US2025309183A1Mounting deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1242US2022157633A1Wafer bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1340US10847369B2Wafer bonding method, method for manufacturing semiconductor device, and apparatus thereforSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·15 claims
- 1440US9082885B2Semiconductor chip bonding apparatus and method of forming semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 14, 2015·0 cites·20 claims
- 1538US10444162B2Method of testing an object and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →