Inventor · disambiguated record
Masaki Kanazawa
Also filed as: KANAZAWA MASAKI
19 granted patents·4 pending applications·129 citations·filing 1998–2022
93Inventor score
Files withTOKYO SEIMITSU CO LTD10SANKEN ELECTRIC CO LTD8KANAZAWA MASAKI2HITACHI LTD1HONDA MOTOR CO LTD1
Top patents by PatentIndex Score
23 records- 0188US10173296B2Grinding machineTOKYO SEIMITSU CO LTD·Filed 2016·Granted Jan 8, 2019·3 cites·4 claims
- 0285US7126342B2Voltage measurement deviceHONDA MOTOR CO LTD·Filed 2004·Granted Oct 24, 2006·37 cites·11 claims
- 0378US7521384B2Method and apparatus for peeling surface protective filmTOKYO SEIMITSU CO LTD·Filed 2006·Granted Apr 21, 2009·7 cites·6 claims
- 0476US10421172B2Processing deviceTOKYO SEIMITSU CO LTD·Filed 2016·Granted Sep 24, 2019·2 cites·8 claims
- 0566US8154118B2Semiconductor deviceKANAZAWA MASAKI·Filed 2009·Granted Apr 10, 2012·5 cites·7 claims
- 0665US8052824B2Film peeling method and film peeling deviceTOKYO SEIMITSU CO LTD·Filed 2006·Granted Nov 8, 2011·2 cites·5 claims
- 0765US7915875B2Current-mode controlled DC-DC converterSANKEN ELECTRIC CO LTD·Filed 2008·Granted Mar 29, 2011·8 cites·4 claims
- 0862US7638900B2Bi-directional DC-DC converterSANKEN ELECTRIC CO LTD·Filed 2008·Granted Dec 29, 2009·6 cites·3 claims
- 0960US10507561B2Grinding apparatusTOKYO SEIMITSU CO LTD·Filed 2017·Granted Dec 17, 2019·0 cites·6 claims
- 1059US6140779AIncrementally preheating and lighting system for a discharge lampSANKEN ELECTRIC CO LTD·Filed 1999·Granted Oct 31, 2000·26 cites·18 claims
- 1153US12466687B2Tape affixing systemTOKYO SEIMITSU CO LTD·Filed 2021·Granted Nov 11, 2025·0 cites·4 claims
- 1253US8052505B2Wafer processing method for processing wafer having bumps formed thereonTOKYO SEIMITSU CO LTD·Filed 2009·Granted Nov 8, 2011·1 cites·4 claims
- 1353US7608918B2Semiconductor deviceSANKEN ELECTRIC CO LTD·Filed 2004·Granted Oct 27, 2009·6 cites·12 claims
- 1453US6157284APackaging of an electric circuit including one or more coilsSANKEN ELECTRIC CO LTD·Filed 1998·Granted Dec 5, 2000·13 cites·9 claims
- 1548US2023238257A1Processing device and methodTOKYO SEIMITSU CO LTD·Filed 2021·Application pending·0 cites
- 1647US2023302603A1Processing deviceTOKYO SEIMITSU CO LTD·Filed 2022·Application pending·0 cites
- 1746US8206198B2Wafer grinding machine and wafer grinding methodKANAZAWA MASAKI·Filed 2008·Granted Jun 26, 2012·0 cites·2 claims
- 1842US6121731ADischarge lamp lighting system with overcurrent protection for an inverter switch or switchesSANKEN ELECTRIC CO LTD·Filed 1999·Granted Sep 19, 2000·11 cites·20 claims
- 1941US7158360B2Solenoid drive circuitSANKEN ELECTRIC CO LTD·Filed 2004·Granted Jan 2, 2007·2 cites·14 claims
- 2041US2010054185A1Wireless Access Network, Communication Quality Management Apparatus, and Wireless Base StationKANEKO MASAAKI·Filed 2009·Application pending·0 cites
- 2140US7880222B2Semiconductor device having plural regions and elements with varying areas depending on the regionSANKEN ELECTRIC CO LTD·Filed 2006·Granted Feb 1, 2011·0 cites·18 claims
- 2238US11141830B2Method for setting processing deviceTOKYO SEIMITSU CO LTD·Filed 2017·Granted Oct 12, 2021·0 cites·1 claims
- 2335US2015089050A1Mobile network systemHITACHI LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →