Inventor · disambiguated record
Makoto Kanda
Also filed as: KANDA MAKOTO
20 granted patents·2 pending applications·316 citations·filing 1990–2019
95Inventor score
Files withMITSUBISHI ELECTRIC CORP6CANON KK4SHARP KK4TOSHIBA KK4MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1
Top patents by PatentIndex Score
22 records- 0190US6281510B1Sample transferring method and sample transfer supporting apparatusTOSHIBA KK·Filed 2000·Granted Aug 28, 2001·52 cites·17 claims
- 0283US6090176ASample transferring method and sample transfer supporting apparatusTOSHIBA KK·Filed 1998·Granted Jul 18, 2000·62 cites·7 claims
- 0382US7390235B2Method for manufacturing image display device, image display device, and TV apparatusCANON KK·Filed 2006·Granted Jun 24, 2008·5 cites·7 claims
- 0480US6525422B1Semiconductor device including bump electrodesSHARP KK·Filed 1997·Granted Feb 25, 2003·51 cites·9 claims
- 0576US7088036B2Method for manufacturing image display device, image display device, and TV apparatusCANON KK·Filed 2004·Granted Aug 8, 2006·9 cites·2 claims
- 0675US6933607B2Semiconductor device with bumps on electrode pads oriented in given directionSHARP KK·Filed 2002·Granted Aug 23, 2005·19 cites·28 claims
- 0772US6213356B1Bump forming apparatus and bump forming methodMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 10, 2001·32 cites·20 claims
- 0871US6760001B2Method of adjusting characteristics of electron source, method of manufacturing electron emission deviceCANON KK·Filed 2002·Granted Jul 6, 2004·12 cites·40 claims
- 0967US7794299B2Method for manufacturing image display device, image display device, and TV apparatusCANON KK·Filed 2008·Granted Sep 14, 2010·1 cites·4 claims
- 1067US7544522B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Jun 9, 2009·17 cites·17 claims
- 1159US5302801ALaser bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Apr 12, 1994·18 cites·7 claims
- 1257US7005741B2Liquid crystal display device and/or circuit substrate including bump electrodes and electrode padsSHARP KK·Filed 2002·Granted Feb 28, 2006·6 cites·9 claims
- 1352US10921767B2Encoder systemTOSHIBA KK·Filed 2019·Granted Feb 16, 2021·0 cites·17 claims
- 1448US10789144B2Supervisory circuit, supervisory system, motor control systemTOSHIBA ELECTRONIC DEVICES & STORAGE CORP·Filed 2018·Granted Sep 29, 2020·0 cites·17 claims
- 1546US6452281B1Semiconductor integrated circuit and fabrication process thereforSHARP KK·Filed 2002·Granted Sep 17, 2002·2 cites·9 claims
- 1643US5250781ALaser bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 5, 1993·9 cites·7 claims
- 1743US2003075451A1Semiconductor integrated circuit, manufacturing method thereof, and manufacturing apparatus thereofFiled 2002·Application pending·0 cites
- 1841US6901093B2Semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted May 31, 2005·0 cites·6 claims
- 1940US2020012594A1Shared fifo deviceTOSHIBA KK·Filed 2018·Application pending·0 cites
- 2039US5009590AMethod and apparatus for preheating semiconductor chipsMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Apr 23, 1991·10 cites·8 claims
- 2138US6611504B1Mobile wireless deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Aug 26, 2003·9 cites·6 claims
- 2237US6998295B2Method of manufacturing a device packageMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Feb 14, 2006·2 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →