Inventor · disambiguated record
Masao Kanno
Also filed as: KANNO MASAO
16 granted patents·335 citations·filing 1987–2001
91Inventor score
Top patents by PatentIndex Score
16 records- 0194US5153987AProcess for producing printed wiring boardsHITACHI CHEMICAL CO LTD·Filed 1989·Granted Oct 13, 1992·85 cites·12 claims
- 0290US6121553ACircuit boards using heat resistant resin for adhesive layersHITACHI CHEMICAL CO LTD·Filed 1997·Granted Sep 19, 2000·157 cites·3 claims
- 0386US5309632AProcess for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 1992·Granted May 10, 1994·66 cites·9 claims
- 0480USPP12781P2Osteospermum plant named ‘Kakegawa AU6’SAKATA SEED CORP·Filed 2000·Granted Jul 16, 2002·2 cites·1 claims
- 0580US10603POsteospermum plant named `Wildside`SAKATA SEED AMERICA INC·Filed 1996·Granted Sep 15, 1998·3 cites·1 claims
- 0676US10596POsteospermum plant named `Brightside`SAKATA SEED AMERICA INC·Filed 1996·Granted Sep 8, 1998·2 cites·1 claims
- 0773USPP12796P2Osteospermum plant named ‘Kakegawa AU1’SAKATA SEED CORP·Filed 2000·Granted Jul 23, 2002·1 cites·1 claims
- 0866US10595POsteospermum plant named `Highside`SAKATA SEED AMERICA INC·Filed 1996·Granted Sep 8, 1998·1 cites·1 claims
- 0961USPP13987P3Osteospermum plant named ‘Kakegawa AU8’SAKATA SEED CORP·Filed 2001·Granted Jul 15, 2003·0 cites·1 claims
- 1061USPP13865P3Osteospermum plant named ‘Kakegawa AU7’SAKATA SEED CORP·Filed 2001·Granted Jun 3, 2003·0 cites·1 claims
- 1157US4791238AHigh-density wired circuit board using insulated wiresHITACHI CHEMICAL CO LTD·Filed 1987·Granted Dec 13, 1988·18 cites·20 claims
- 1238US10782POsteospermum plant named `Seaside`SAKATA SEED AMERICA INC·Filed 1996·Granted Feb 9, 1999·0 cites·1 claims
- 1337USPP12812P2Osteospermum plant named ‘Kakegawa AU4’SAKATA SEED CORP·Filed 2000·Granted Jul 30, 2002·0 cites·1 claims
- 1437USPP12795P2Osteospermum plant named ‘Kakegawa AU2’SAKATA SEED CORP·Filed 2000·Granted Jul 23, 2002·0 cites·1 claims
- 1537USPP12780P2Osteospermum plant named ‘Kakegawa AU5’SAKATA SEED CORP·Filed 2000·Granted Jul 16, 2002·0 cites·1 claims
- 1637USPP12778P2Osteospermum plant named ‘Kakegawa AU3’SAKATA SEED CORP·Filed 2000·Granted Jul 16, 2002·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →