Inventor · disambiguated record
Mark J. Kapeckas
Also filed as: KAPECKAS MARK J
15 granted patents·8 pending applications·302 citations·filing 1995–2005
94Inventor score
Top patents by PatentIndex Score
23 records- 0192US6911068B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Jun 28, 2005·35 cites·23 claims
- 0290US6827839B2Plating bath analysisSHIPLEY CO LLC·Filed 2001·Granted Dec 7, 2004·33 cites·8 claims
- 0390US6773573B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Aug 10, 2004·31 cites·17 claims
- 0490US6736954B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted May 18, 2004·27 cites·31 claims
- 0583US6652731B2Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Granted Nov 25, 2003·28 cites·15 claims
- 0678US6565731B1Electroplating processSHIPLEY CO LLC·Filed 1997·Granted May 20, 2003·33 cites·9 claims
- 0777US6752878B2Process for treating adhesion promoted metal surfacesSHIPLEY CO LLC·Filed 2001·Granted Jun 22, 2004·23 cites·14 claims
- 0876US5626736AElectroplating processSHIPLEY CO LLC·Filed 1996·Granted May 6, 1997·32 cites·26 claims
- 0968US5738776AElectroplating processSHIPLEY CO LLC·Filed 1996·Granted Apr 14, 1998·18 cites·6 claims
- 1062US7384535B2Bath analysisROHM & HAAS ELECT MAT·Filed 2004·Granted Jun 10, 2008·6 cites·8 claims
- 1156US2006081475A1Reverse pulse plating composition and methodSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 1254US2005139118A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2004·Application pending·0 cites
- 1352US5858198AElectroplating processSHIPLEY CO LLC·Filed 1997·Granted Jan 12, 1999·14 cites·14 claims
- 1451US6231619B1Electroplating processSHIPLEY CO LLC·Filed 1995·Granted May 15, 2001·10 cites·22 claims
- 1550US2004074778A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1649US2005155866A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1747US2005016858A1Reverse pulse plating composition and methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 1843US2006151327A1Analysis methodROHM & HAAS ELECT MAT·Filed 2004·Application pending·0 cites
- 1942US2004104124A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2041US2003066756A1Plating bath and method for depositing a metal layer on a substrateSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 2137US5618400AElectroplating processSHIPLEY CO LLC·Filed 1995·Granted Apr 8, 1997·4 cites·27 claims
- 2232US5683565AElectroplating processSHIPLEY CO LLC·Filed 1996·Granted Nov 4, 1997·4 cites·5 claims
- 2332US5611905AElectroplating processSHIPLEY CO LLC·Filed 1995·Granted Mar 18, 1997·4 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →