Inventor · disambiguated record
Masayasu Kawamura
Also filed as: KAWAMURA MASAYASU
15 granted patents·1 pending application·631 citations·filing 1994–2014
94Inventor score
Files withHITACHI LTD6HITACHI ULSI SYS CO LTD3TEXAS INSTRUMENTS INC2TOYO INK MFG CO2ELPIDA MEMORY INC1
Top patents by PatentIndex Score
16 records- 0198US6555918B2Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 2002·Granted Apr 29, 2003·188 cites·9 claims
- 0298US6426560B1Semiconductor device and memory moduleHITACHI LTD·Filed 2000·Granted Jul 30, 2002·167 cites·18 claims
- 0392US6252299B1Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 1998·Granted Jun 26, 2001·98 cites·7 claims
- 0490US6566760B1Semiconductor storage device having memory chips in a stacked structureHITACHI LTD·Filed 2000·Granted May 20, 2003·47 cites·1 claims
- 0580US6383845B2Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 2001·Granted May 7, 2002·20 cites·8 claims
- 0676US7227251B2Semiconductor device and a memory system including a plurality of IC chips in a common packageELPIDA MEMORY INC·Filed 2005·Granted Jun 5, 2007·6 cites·10 claims
- 0775US6566432B2Coloring resin composition and molded articlesTOYO INK MFG CO·Filed 2001·Granted May 20, 2003·13 cites·10 claims
- 0866US5475692ASemiconductor memory deviceHITACHI LTD·Filed 1995·Granted Dec 12, 1995·27 cites·16 claims
- 0965US5596535ASemiconductor storage deviceTEXAS INSTRUMENTS INC·Filed 1994·Granted Jan 21, 1997·26 cites·1 claims
- 1062US6885092B1Semiconductor device and a memory system including a plurality of IC chips in a common packageHITACHI ULSI SYS CO LTD·Filed 1999·Granted Apr 26, 2005·24 cites·4 claims
- 1161US7001937B2Process for producing colored resin composition and utilization thereofTOYO INK MFG CO·Filed 2002·Granted Feb 21, 2006·4 cites·4 claims
- 1257US10563454B2Heat-ray-blocking fluororesin filmTORAY ADVANCED FILM CO LTD·Filed 2014·Granted Feb 18, 2020·0 cites·11 claims
- 1349US7012321B2Stacked semiconductor device including improved lead frame arrangementHITACHI ULSI SYS CO LTD·Filed 2003·Granted Mar 14, 2006·2 cites·7 claims
- 1444US5498897ATransistor layout for semiconductor integrated circuitTEXAS INSTRUMENTS INC·Filed 1994·Granted Mar 12, 1996·9 cites·8 claims
- 1543US7122883B2Stacked semiconductor device including improved lead frame arrangementHITACHI ULSI SYS CO LTD·Filed 2004·Granted Oct 17, 2006·0 cites·8 claims
- 1640US2003075789A1Semiconductor storage device having memory chips in a stacked structureFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →