Inventor · disambiguated record
Masaki Kawata
Also filed as: KAWATA MASAKI
8 granted patents·5 pending applications·5 citations·filing 2007–2025
75Inventor score
Top patents by PatentIndex Score
13 records- 0173US9974185B2Component-embedded substrateMURATA MANUFACTURING CO·Filed 2016·Granted May 15, 2018·2 cites·18 claims
- 0266US10278289B2Resin circuit board and resin circuit board having component mounted thereonMURATA MANUFACTURING CO·Filed 2018·Granted Apr 30, 2019·1 cites·15 claims
- 0364US7615874B2Electronic component moduleMURATA MANUFACTURING CO·Filed 2007·Granted Nov 10, 2009·2 cites·7 claims
- 0458US2025294677A1Resin multilayer substrate and electronic deviceMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 0555US2009260856A1Electronic component moduleMURATA MANUFACTURING CO·Filed 2009·Application pending·0 cites
- 0654US2009311608A1Anode and secondary batterySONY CORP·Filed 2009·Application pending·0 cites
- 0749US2009184446A1Method and system for stretching polymer filmFUJIFILM CORP·Filed 2009·Application pending·0 cites
- 0848US9854677B2Module componentMURATA MANUFACTURING CO·Filed 2016·Granted Dec 26, 2017·0 cites·19 claims
- 0947US9961780B2Method for manufacturing resin multilayer boardMURATA MANUFACTURING CO·Filed 2015·Granted May 1, 2018·0 cites·16 claims
- 1046US10098238B2Method of manufacturing resin multilayer substrateMURATA MANUFACTURING CO·Filed 2015·Granted Oct 9, 2018·0 cites·10 claims
- 1141US2019053386A1Resin multilayer substrate manufacturing methodMURATA MANUFACTURING CO·Filed 2018·Application pending·0 cites
- 1234US10154597B2Component mount boardMURATA MANUFACTURING CO·Filed 2018·Granted Dec 11, 2018·0 cites·20 claims
- 1334US9730322B2Production method of component-embedded substrate, and component-embedded substrateMURATA MANUFACTURING CO·Filed 2015·Granted Aug 8, 2017·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →