Inventor · disambiguated record
Masayoshi Kido
Also filed as: KIDO MASAYOSHI
13 granted patents·1 pending application·8 citations·filing 2011–2022
84Inventor score
Top patents by PatentIndex Score
14 records- 0177US8828525B2Flexible printed circuit board integrated with reinforcing plate, and method for manufacturing flexible printed circuit board integrated with reinforcing plateKIDO MASAYOSHI·Filed 2011·Granted Sep 9, 2014·2 cites·25 claims
- 0272US9835942B2Photosensitive resin composition and use thereofSEKITO YOSHIHIDE·Filed 2011·Granted Dec 5, 2017·2 cites·14 claims
- 0368US9072177B2Conductive layer integrated FPCKIDO MASAYOSHI·Filed 2012·Granted Jun 30, 2015·2 cites·5 claims
- 0463US10292262B2Reinforcing-plate-integrated flexible printed circuit boardKANEKA CORP·Filed 2013·Granted May 14, 2019·1 cites·6 claims
- 0562US9237645B2Flexible printed circuit integrated with conductive layerKIDO MASAYOSHI·Filed 2012·Granted Jan 12, 2016·1 cites·5 claims
- 0656US12227609B2Thermosetting resin composition, thermosetting resin film, thermoset film, multilayer body, printed wiring board and method for producing sameKANEKA CORP·Filed 2022·Granted Feb 18, 2025·0 cites·18 claims
- 0755US11993740B2Low dielectric resin composition, molded article, film, multilayer film and flexible printed wiring boardKANEKA CORP·Filed 2021·Granted May 28, 2024·0 cites·11 claims
- 0855US10045433B2Conductive-layer-integrated flexible printed circuit boardKANEKA CORP·Filed 2017·Granted Aug 7, 2018·0 cites·5 claims
- 0954US9723708B2Conductive-layer-integrated flexible printed circuit boardKANEKA CORP·Filed 2013·Granted Aug 1, 2017·0 cites·4 claims
- 1050US10030133B2Black photosensitive resin composition and use of sameKANEKA CORP·Filed 2012·Granted Jul 24, 2018·0 cites·7 claims
- 1150US9204528B2Flexible printed circuit integrated with stiffenerKIDO MASAYOSHI·Filed 2012·Granted Dec 1, 2015·0 cites·4 claims
- 1249US10822465B2Black resin composition, polyimide with black resin cured film and production method therefor, and flexible printed wiring board using black resin cured filmKANEKA CORP·Filed 2016·Granted Nov 3, 2020·0 cites·21 claims
- 1343US10975263B2Thermosetting resin composition, cured film and method for producing same, and flexible printed board with cured film and method for producing sameKANEKA CORP·Filed 2017·Granted Apr 13, 2021·0 cites·14 claims
- 1432US2020045833A1Printed wiring board and method for manufacturing sameKANEKA CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →