Inventor · disambiguated record
Masayuki Kitajima
Also filed as: KITAJIMA MASAYUKI
31 granted patents·20 pending applications·290 citations·filing 1995–2019
97Inventor score
Files withFUJITSU LTD36KITAJIMA MASAYUKI4KOBAYASHI HIROSHI3TAIYO YUDEN KK3FUJITSU LTD KAWASAKI JAPAN1
Top patents by PatentIndex Score
51 records- 0189US6184475B1Lead-free solder composition with Bi, In and SnFUJITSU LTD·Filed 1995·Granted Feb 6, 2001·64 cites·12 claims
- 0283US8418910B2Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor deviceYAMAKAMI TAKATOYO·Filed 2012·Granted Apr 16, 2013·8 cites·10 claims
- 0383US6653761B2Micro-actuator and method of producing the sameFUJITSU LTD·Filed 2001·Granted Nov 25, 2003·22 cites·2 claims
- 0483US6361626B1Solder alloy and soldered bondFUJITSU LTD·Filed 2001·Granted Mar 26, 2002·19 cites·4 claims
- 0579US6521176B2Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloyFUJITSU LTD·Filed 2000·Granted Feb 18, 2003·20 cites·3 claims
- 0677US9615464B2Method of mounting semiconductor element, and semiconductor deviceFUJITSU LTD·Filed 2013·Granted Apr 4, 2017·4 cites·12 claims
- 0777US6344690B1Semiconductor device with gold bumps, and method and apparatus of producing the sameFUJITSU LTD·Filed 2000·Granted Feb 5, 2002·15 cites·9 claims
- 0874US6495441B2Semiconductor device with gold bumps, and method and apparatus of producing the sameFUJITSU LTD·Filed 2000·Granted Dec 17, 2002·12 cites·1 claims
- 0970US7565739B2Method of making zinc-aluminum alloy connectionFUJITSU LTD·Filed 2006·Granted Jul 28, 2009·5 cites·12 claims
- 1069US6541898B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2001·Granted Apr 1, 2003·14 cites·7 claims
- 1168US11012048B2Filter and multiplexerTAIYO YUDEN KK·Filed 2019·Granted May 18, 2021·1 cites·10 claims
- 1267US7911116B2Surface acoustic wave device and method of fabricating the sameTAIYO YUDEN KK·Filed 2009·Granted Mar 22, 2011·4 cites·12 claims
- 1367US6428911B2Soldering method and soldered jointFUJITSU LTD·Filed 2001·Granted Aug 6, 2002·15 cites·9 claims
- 1466US8314339B2Circuit board with kneaded conductive pasteKITAJIMA MASAYUKI·Filed 2009·Granted Nov 20, 2012·4 cites·9 claims
- 1566US6467141B2Method of assembling micro-actuatorFUJITSU LTD·Filed 2001·Granted Oct 22, 2002·12 cites·14 claims
- 1664US7425765B2Zinc-aluminum solder alloyFUJITSU LTD·Filed 2005·Granted Sep 16, 2008·3 cites·10 claims
- 1764US6848154B2Method of producing a micro-actuatorFUJITSU LTD·Filed 2003·Granted Feb 1, 2005·8 cites·8 claims
- 1862US6786385B1Semiconductor device with gold bumps, and method and apparatus of producing the sameFUJITSU LTD·Filed 2000·Granted Sep 7, 2004·6 cites·5 claims
- 1962US6333554B1Semiconductor device with gold bumps, and method and apparatus of producing the sameFUJITSU LTD·Filed 1998·Granted Dec 25, 2001·15 cites·8 claims
- 2060US8604347B2Board reinforcing structure, board assembly, and electronic deviceKOBAYASHI HIROSHI·Filed 2011·Granted Dec 10, 2013·1 cites·17 claims
- 2158US6596094B2Solder paste and electronic deviceFUJITSU LTD·Filed 2001·Granted Jul 22, 2003·7 cites·21 claims
- 2258US6107181AMethod of forming bumps and template used for forming bumpsFUJITSU LTD·Filed 1998·Granted Aug 22, 2000·17 cites·9 claims
- 2356US2013233494A1Component adhesive bonding structure and component separation methodFUJITSU LTD·Filed 2013·Application pending·0 cites
- 2455US6893512B2Solder alloy and soldered bondFUJITSU LTD·Filed 2003·Granted May 17, 2005·5 cites·3 claims
- 2553US9195003B2Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the sameFUJITSU LTD·Filed 2013·Granted Nov 24, 2015·0 cites·13 claims
- 2650US2008102294A1Electrically conductive paste and method of making the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 2749US2014036198A1Substrate module, electronic apparatus, and manufacturing method for electronic apparatusFUJITSU LTD·Filed 2013·Application pending·0 cites
- 2848US10989743B2Power-demand-value calculating system, power-demand-value calculating method, and recording medium recording power-demand-value calculating programFUJITSU LTD·Filed 2018·Granted Apr 27, 2021·0 cites·20 claims
- 2948US2017032448A1Ordering program, ordering device, and ordering methodFUJITSU LTD·Filed 2016·Application pending·0 cites
- 3048US2009044972A1Circuit board, method of forming wiring pattern, and method of manufacturing circuit boardFUJITSU LTD KAWASAKI JAPAN·Filed 2008·Application pending·0 cites
- 3147US6744183B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2003·Granted Jun 1, 2004·2 cites·2 claims
- 3246US2013140069A1Conductive bonding material, electronic component, and electronic deviceFUJITSU LTD·Filed 2012·Application pending·0 cites
- 3346US2009175470A1Acoustic wave device and method of manufacturing the sameFUJITSU MEDIA DEVICES LTD·Filed 2009·Application pending·0 cites
- 3444US9053262B2Method of determining reinforcement position of circuit substrate and substrate assemblyFUJITSU LTD·Filed 2012·Granted Jun 9, 2015·0 cites·3 claims
- 3544US7356894B2Method of producing a micro-actuatorFUJITSU LTD·Filed 2004·Granted Apr 15, 2008·0 cites·4 claims
- 3644US2011165319A1Apparatus for forming solder dam and method of forming solder damFUJITSU LTD·Filed 2010·Application pending·0 cites
- 3742US2011163152A1Method of forming solder damFUJITSU LTD·Filed 2010·Application pending·0 cites
- 3842US2013313309A1Conductive bonding material, method of manufacturing the same, and method of manufacturing electronic deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 3941US2013088839A1Board module manufacturing method, board module, and board module assemblyFUJITSU LTD·Filed 2012·Application pending·0 cites
- 4040US7841064B2Method of manufacturing an acoustic wave deviceTAIYO YUDEN KK·Filed 2007·Granted Nov 30, 2010·0 cites·2 claims
- 4140US2003095888A1Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloyFUJITSU LTD·Filed 2002·Application pending·0 cites
- 4240US2013087605A1Conductive bonding material, conductor bonding method, and semiconductor device production methodKUBOTA TAKASHI·Filed 2012·Application pending·0 cites
- 4339US2012248616A1Electronic component, electronic equipment, and soldering pasteKITAJIMA MASAYUKI·Filed 2012·Application pending·0 cites
- 4438US2011303450A1Mounting structure, electronic component, circuit board, board assembly, electronic device, and stress relaxation memberOKADA TORU·Filed 2011·Application pending·0 cites
- 4538US2011165338A1Apparatus for forming solder damFUJITSU LTD·Filed 2010·Application pending·0 cites
- 4638US2011303449A1Packaging structure, printed circuit board assembly and fixing methodKOBAYASHI HIROSHI·Filed 2011·Application pending·0 cites
- 4738US2011304059A1Circuit board, circuit board assembly, and semiconductor deviceKOBAYASHI HIROSHI·Filed 2011·Application pending·0 cites
- 4834US6320158B1Method and apparatus of fabricating perforated plateFUJITSU LTD·Filed 1999·Granted Nov 20, 2001·5 cites·9 claims
- 4934US2012024475A1Display bonding device and methodKITAJIMA MASAYUKI·Filed 2011·Application pending·0 cites
- 5033US2011303443A1Mount structure, electronic apparatus, stress relieving unit, and method of manufacturing stress relieving unitKITAJIMA MASAYUKI·Filed 2011·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →