Inventor · disambiguated record
Masayasu Kizaki
Also filed as: KIZAKI MASAYASU
1 granted patent·1 pending application·59 citations·filing 1991–2002
50Inventor score
Files withCASIO COMPUTER CO LTD2
Top patents by PatentIndex Score
2 records- 0175US5161009AIc module having a folding junction structureCASIO COMPUTER CO LTD·Filed 1991·Granted Nov 3, 1992·59 cites·18 claims
- 0226US2002132461A1Semiconductor device having bump electrodes with a stress dissipating structure and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →