Inventor · disambiguated record
Marcin Klobus
Also filed as: KLOBUS MARCIN
2 granted patents·1 pending application·0 citations·filing 2012–2024
26Inventor score
Technology areasC25D
Top patents by PatentIndex Score
3 records- 0176US12439528B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2024·Granted Oct 7, 2025·0 cites·13 claims
- 0259US12245383B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Mar 4, 2025·0 cites·12 claims
- 0338US2015289387A1Method for combined through-hole plating and via fillingATOTECH DEUTSCHLAND GMBH·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →