Inventor · disambiguated record
Masashi Koda
Also filed as: KODA MASASHI
10 granted patents·2 pending applications·2 citations·filing 2018–2022
76Inventor score
Files withPANASONIC IP MAN CO LTD12
Top patents by PatentIndex Score
12 records- 0184US11866536B2Copper-clad laminate plate, resin-attached copper foil, and circuit board using samePANASONIC IP MAN CO LTD·Filed 2019·Granted Jan 9, 2024·2 cites·12 claims
- 0264US11242425B2Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring platePANASONIC IP MAN CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·25 claims
- 0362US11958951B2Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 16, 2024·0 cites·19 claims
- 0457US12022611B2Prepreg, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Jun 25, 2024·0 cites·10 claims
- 0557US11401393B2Prepreg, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Aug 2, 2022·0 cites·7 claims
- 0656US12428534B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminated board, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Sep 30, 2025·0 cites·17 claims
- 0756US12024590B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2019·Granted Jul 2, 2024·0 cites·17 claims
- 0856US2024182614A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 0955US12312452B2Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted May 27, 2025·0 cites·24 claims
- 1053US11820105B2Prepreg, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Granted Nov 21, 2023·0 cites·6 claims
- 1151US12233621B2Copper-clad laminated plate, resin-clad copper foil, and circuit substrate using said plate and foilPANASONIC IP MAN CO LTD·Filed 2020·Granted Feb 25, 2025·0 cites·12 claims
- 1243US2022289969A1Resin composition, prepreg, resin-equipped film, resin-equipped metal foil, metal-cladded layered sheet, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →