Inventor · disambiguated record
Masayoshi Kondo
Also filed as: KONDO MASAYOSHI
16 granted patents·6 pending applications·600 citations·filing 1988–2024
94Inventor score
Top patents by PatentIndex Score
22 records- 0197US5720423AFastener driving toolMAKITA CORP·Filed 1996·Granted Feb 24, 1998·231 cites·7 claims
- 0294US5622035AQuick blade attachment structure for mowersMAKITA CORP·Filed 1995·Granted Apr 22, 1997·120 cites·22 claims
- 0393US10855910B2Electronic device, method, and programKYOCERA CORP·Filed 2019·Granted Dec 1, 2020·36 cites·14 claims
- 0484US5769657AAttachment structure of battery pack to power-driven toolsMAKITA CORP·Filed 1996·Granted Jun 23, 1998·85 cites·27 claims
- 0581USRE38122EMiter sawMAKITA CORP·Filed 2000·Granted May 27, 2003·23 cites·37 claims
- 0673US8153901B2Method for fabricating multilayer circuit board, circuit plate, and method for fabricating the circuit plateKONDO MASAYOSHI·Filed 2006·Granted Apr 10, 2012·6 cites·28 claims
- 0772US8742568B2Circuit board, semiconductor device, process for manufacturing circuit board and process for manufacturing semiconductor deviceKONDO MASAYOSHI·Filed 2011·Granted Jun 3, 2014·4 cites·10 claims
- 0871US5661909ABlade mounting device in cutting toolMAKITA CORP·Filed 1995·Granted Sep 2, 1997·33 cites·22 claims
- 0970US5823085AMiter sawMAKITA CORP·Filed 1996·Granted Oct 20, 1998·27 cites·17 claims
- 1066US2025164130A1Liquid micronization apparatusPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 1165US7576288B2Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boardsSUMITOMO BAKELITE CO·Filed 2003·Granted Aug 18, 2009·15 cites·7 claims
- 1264US4886559AHigh strength titanium material having improved ductilityNIPPON STEEL CORP·Filed 1988·Granted Dec 12, 1989·17 cites·3 claims
- 1353US9002573B2Electronic control unit and information management systemKAWAMURA YOSHIKUNI·Filed 2011·Granted Apr 7, 2015·2 cites·11 claims
- 1451US8748751B2Electronic component package and method for producing electronic component packageCHUMA TOSHIAKI·Filed 2009·Granted Jun 10, 2014·1 cites·14 claims
- 1549US2016062485A1Electronic deviceKYOCERA CORP·Filed 2014·Application pending·0 cites
- 1645US8042263B2Process for manufacturing circuit boardSUMITOMO BAKELITE CO·Filed 2007·Granted Oct 25, 2011·0 cites·17 claims
- 1744US2011031000A1Resin composition, carrier material with resin, multi-layered printed circuit board, and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2009·Application pending·0 cites
- 1842US2011120754A1Multilayer wiring board and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2007·Application pending·0 cites
- 1942US2010326712A1Circuit board and method for manufacturing the sameSUMITOMO BAKELITE CO·Filed 2009·Application pending·0 cites
- 2032US10397041B2Electronic control unitDENSO CORP·Filed 2017·Granted Aug 27, 2019·0 cites·12 claims
- 2129US5803147AVertical blindMAKITA CORP·Filed 1996·Granted Sep 8, 1998·0 cites·16 claims
- 2228US2018034851A1Electronic control apparatusDENSO CORP·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Masayoshi Kondo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →