Inventor · disambiguated record
Mark Kostinovsky
Also filed as: KOSTINOVSKY MARK · KOSTINOVSKY MARK ALEX
6 granted patents·2 pending applications·1 citations·filing 2008–2023
65Inventor score
Top patents by PatentIndex Score
8 records- 0163US12226822B2Additive manufacturing process of 3D electronic substrateSCHLUMBERGER TECHNOLOGY CORP·Filed 2023·Granted Feb 18, 2025·0 cites·17 claims
- 0262US10180035B2Soldered components for downhole useSCHLUMBERGER TECHNOLOGY CORP·Filed 2015·Granted Jan 15, 2019·1 cites·30 claims
- 0350US11676926B2Solder joints on nickel surface finishes without gold platingSCHLUMBERGER TECHNOLOGY CORP·Filed 2020·Granted Jun 13, 2023·0 cites·12 claims
- 0450US11329023B2Interconnection of copper surfaces using copper sintering materialSCHLUMBERGER TECHNOLOGY CORP·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 0547US10376995B2Tin-antimony-based high temperature solder for downhole componentsSCHLUMBERGER TECHNOLOGY CORP·Filed 2014·Granted Aug 13, 2019·0 cites·17 claims
- 0645US2010012708A1Oilfield tools comprising modified-soldered electronic components and methods of manufacturing sameSCHLUMBERGER TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 0738US11765839B2Additive manufactured 3D electronic substrateSCHLUMBERGER TECHNOLOGY CORP·Filed 2018·Granted Sep 19, 2023·0 cites·18 claims
- 0837US2014290931A1High Temperature Solder For Downhole ComponentsUNIV MARYLAND·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →