Inventor · disambiguated record
Marie Krysak
Also filed as: KRYSAK MARIE
30 granted patents·8 pending applications·31 citations·filing 2014–2024
94Inventor score
Files withINTEL CORP38
Top patents by PatentIndex Score
38 records- 0196US10892223B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2016·Granted Jan 12, 2021·11 cites·25 claims
- 0295US12218052B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 0391US11854787B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2022·Granted Dec 26, 2023·1 cites·19 claims
- 0489US9899255B2Via blocking layerINTEL CORP·Filed 2014·Granted Feb 20, 2018·8 cites·25 claims
- 0588US2025125260A1Advanced lithography and self-assembled devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0685US11373950B2Advanced lithography and self-assembled devicesINTEL CORP·Filed 2020·Granted Jun 28, 2022·1 cites·19 claims
- 0785US11320734B2Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resistsINTEL CORP·Filed 2016·Granted May 3, 2022·2 cites·16 claims
- 0882US10256141B2Maskless air gap to prevent via punch throughINTEL CORP·Filed 2015·Granted Apr 9, 2019·3 cites·20 claims
- 0978US11137681B2Lined photobucket structure for back end of line (BEOL) interconnect formationINTEL CORP·Filed 2016·Granted Oct 5, 2021·2 cites·19 claims
- 1077US11874600B2Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resistsINTEL CORP·Filed 2022·Granted Jan 16, 2024·0 cites·14 claims
- 1177US11315798B2Two-stage bake photoresist with releasable quencherINTEL CORP·Filed 2016·Granted Apr 26, 2022·2 cites·11 claims
- 1277US2024360264A1Chemical compositions & methods of patterning microelectronic device structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1373US11862463B2Metal oxide nanoparticles as fillable hardmask materialsINTEL CORP·Filed 2021·Granted Jan 2, 2024·0 cites·8 claims
- 1471US12037434B2Chemical compositions and methods of patterning microelectronic device structuresINTEL CORP·Filed 2021·Granted Jul 16, 2024·0 cites·6 claims
- 1571US11953826B2Lined photobucket structure for back end of line (BEOL) interconnect formationINTEL CORP·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 1670US11955343B2Two-stage bake photoresist with releasable quencherINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·9 claims
- 1767US12012473B2Directed self-assembly structures and techniquesINTEL CORP·Filed 2020·Granted Jun 18, 2024·0 cites·20 claims
- 1867US11955377B2Differential hardmasks for modulation of electrobucket sensitivityINTEL CORP·Filed 2022·Granted Apr 9, 2024·0 cites·21 claims
- 1961US2025293149A1Ic die fabrication with self-alignment of multi-level featuresINTEL CORP·Filed 2024·Application pending·0 cites
- 2061US2025110408A1Switchable underlayers for euv lithographyINTEL CORP·Filed 2023·Application pending·0 cites
- 2158US11846883B2Chain scission photoresists and methods for forming chain scission photoresistsINTEL CORP·Filed 2018·Granted Dec 19, 2023·0 cites·10 claims
- 2258US10971394B2Maskless air gap to prevent via punch throughINTEL CORP·Filed 2019·Granted Apr 6, 2021·0 cites·15 claims
- 2357US10672650B2Via blocking layerINTEL CORP·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 2456US11262654B2Chain scission resist compositions for EUV lithography applicationsINTEL CORP·Filed 2019·Granted Mar 1, 2022·0 cites·17 claims
- 2555US11227766B2Metal oxide nanoparticles as fillable hardmask materialsINTEL CORP·Filed 2016·Granted Jan 18, 2022·0 cites·14 claims
- 2655US2024201586A1Precursors and methods for producing tin-based photoresistINTEL CORP·Filed 2022·Application pending·0 cites
- 2752US11406972B2Activation of protected cross-linking catalysts during formation of dielectric materialsINTEL CORP·Filed 2015·Granted Aug 9, 2022·0 cites·9 claims
- 2851US11251072B2Differential hardmasks for modulation of electrobucket sensitivityINTEL CORP·Filed 2016·Granted Feb 15, 2022·0 cites·6 claims
- 2951US11217456B2Selective etching and controlled atomic layer etching of transition metal oxide films for device fabricationINTEL CORP·Filed 2018·Granted Jan 4, 2022·0 cites·24 claims
- 3050US12107044B2Metal oxycarbide resists as leave behind plugsINTEL CORP·Filed 2019·Granted Oct 1, 2024·0 cites·25 claims
- 3150US11984317B2EUV patterning methods, structures, and materialsINTEL CORP·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 3248US2022199462A1Via opening rectification using lamellar triblock copolymer, polymer nanocomposite, or mixed epitaxyINTEL CORP·Filed 2021·Application pending·0 cites
- 3346US10692757B2Means to decouple the diffusion and solubility switch mechanisms of photoresistsINTEL CORP·Filed 2015·Granted Jun 23, 2020·0 cites·11 claims
- 3446US10535601B2Via blocking layerINTEL CORP·Filed 2016·Granted Jan 14, 2020·0 cites·20 claims
- 3546US2017345643A1Photodefinable alignment layer for chemical assisted patterningINTEL CORP·Filed 2014·Application pending·0 cites
- 3645US11152254B2Pitch quartered three-dimensional air gapsINTEL CORP·Filed 2016·Granted Oct 19, 2021·0 cites·9 claims
- 3745US11024538B2Hardened plug for improved shorting marginINTEL CORP·Filed 2016·Granted Jun 1, 2021·0 cites·18 claims
- 3845US2022199540A1Guided vias in microelectronic structuresINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →