Inventor · disambiguated record
Masaru Kusaka
Also filed as: KUSAKA MASARU
4 granted patents·6 pending applications·98 citations·filing 2001–2006
77Inventor score
Top patents by PatentIndex Score
10 records- 0195US7374652B2Plating methodROHM & HAAS ELECT MAT·Filed 2006·Granted May 20, 2008·62 cites·6 claims
- 0288US6835294B2Electrolytic copper plating methodSHIPLEY CO LLC·Filed 2002·Granted Dec 28, 2004·27 cites·10 claims
- 0355US6761814B2Via filling methodSHIPLEY CO LLC·Filed 2002·Granted Jul 13, 2004·6 cites·9 claims
- 0450US6977035B2Method for electrolytic copper platingSHIPLEY CO LLC·Filed 2003·Granted Dec 20, 2005·3 cites·6 claims
- 0546US2005164020A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 0642US2003221967A1Via filling methodSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 0742US2004118691A1Electroplating methodSHIPLEY CO LLC·Filed 2002·Application pending·0 cites
- 0839US2004050706A1Copper electroplating method using insoluble anodeFiled 2001·Application pending·0 cites
- 0938US2004072015A1Composite material with improved binding strength and method for forming the sameSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 1035US2004089557A1Process for electrolytic copper platingSHIPLEY CO LLC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →