Inventor · disambiguated record
Masashi Kuwabara
Also filed as: KUWABARA MASASHI
1 granted patent·24 pending applications·0 citations·filing 2015–2025
2Inventor score
Top patents by PatentIndex Score
25 records- 0153US2024243049A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0253US2024363541A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0352US2024306296A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0452US2025048562A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0552US2025008652A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0651US2024365468A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0751US2024407094A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0850US2024284606A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0950US2024389231A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1049US12388025B2Wiring substrateIBIDEN CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1149US2024324103A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1249US2024196526A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 1348US2024023250A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 1448US2024339393A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1548US2024030144A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 1648US2024339388A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1747US2024431031A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1846US2024341033A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1946US2023397335A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 2046US2024341034A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 2145US2025254795A1Wiring substrateIBIDEN CO LTD·Filed 2025·Application pending·0 cites
- 2241US2025151195A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 2341US2019291358A1Method For Producing Three-Dimensional Object, Ink Set, And Apparatus For Producing Three-Dimensional ObjectSEIKO EPSON CORP·Filed 2019·Application pending·0 cites
- 2439US2018281291A13d object forming device and 3d object forming methodSEIKO EPSON CORP·Filed 2018·Application pending·0 cites
- 2530US2016173724A1Printing apparatus, printing method, program, and image processing apparatusSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →