Inventor · disambiguated record
Masahiro Kyozuka
Also filed as: KYOZUKA MASAHIRO
12 granted patents·5 pending applications·116 citations·filing 1999–2023
89Inventor score
Files withSHINKO ELECTRIC IND CO12KYOZUKA MASAHIRO2KOIZUMI NAOYUKI1MURAMATSU SHIGETSUGU1TATEIWA AKIHIKO1
Top patents by PatentIndex Score
17 records- 0197US8941230B2Semiconductor package and manufacturing methodSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 27, 2015·79 cites·5 claims
- 0283US10098228B2Electronic component device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2015·Granted Oct 9, 2018·4 cites·8 claims
- 0380US8692363B2Electric part package and manufacturing method thereofKOIZUMI NAOYUKI·Filed 2011·Granted Apr 8, 2014·6 cites·7 claims
- 0480US7597929B2Method of manufacturing a wiring substrateSHINKO ELECTRIC IND CO·Filed 2007·Granted Oct 6, 2009·9 cites·10 claims
- 0577US11171080B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2019·Granted Nov 9, 2021·3 cites·8 claims
- 0674US9299678B2Semiconductor package and manufacturing method thereforKYOZUKA MASAHIRO·Filed 2011·Granted Mar 29, 2016·5 cites·9 claims
- 0773US9142524B2Semiconductor package and method for manufacturing semiconductor packageKYOZUKA MASAHIRO·Filed 2012·Granted Sep 22, 2015·4 cites·20 claims
- 0868US8901725B2Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the sameTATEIWA AKIHIKO·Filed 2011·Granted Dec 2, 2014·4 cites·6 claims
- 0963US12082346B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2023·Granted Sep 3, 2024·0 cites·14 claims
- 1060US7329568B2Method of forming active device on substrate that includes embossing insulating resin layer with metal moldSHINKO ELECTRIC IND CO·Filed 2005·Granted Feb 12, 2008·2 cites·5 claims
- 1152US10383228B2Electronic component device and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2018·Granted Aug 13, 2019·0 cites·24 claims
- 1250US2005161157A1Substrate treating apparatus and methodSHINKO ELECTRIC IND CO·Filed 2005·Application pending·0 cites
- 1343US2006043570A1Substrate, semiconductor device, substrate fabricating method, and semiconductor device fabricating methodMURAMATSU SHIGETSUGU·Filed 2005·Application pending·0 cites
- 1441US9941232B2Electronic component deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Apr 10, 2018·0 cites·10 claims
- 1537US2001028108A1Semiconductor device having external connecting terminals and process for manufacturing the deviceSHINKO ELECTRIC IND CO·Filed 2001·Application pending·0 cites
- 1635US2019013263A1Wiring board and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2018·Application pending·0 cites
- 1729US2003107131A1Semiconductor device having external connecting terminals and process for manufacturing the deviceSHINKO ELECTRIC IND CO·Filed 1999·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Masahiro Kyozuka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →