Inventor · disambiguated record
Mankit Lam
Also filed as: LAM MANKIT
1 granted patent·5 pending applications·1 citations·filing 2018–2024
15Inventor score
Files withMICROCHIP TECH INC6
Top patents by PatentIndex Score
6 records- 0152US2025096060A1Integrated circuit deviceMICROCHIP TECH INC·Filed 2024·Application pending·0 cites
- 0250US11600523B2Semiconductor package having exposed redistribution layer features and related methods of packaging and testingMICROCHIP TECH INC·Filed 2018·Granted Mar 7, 2023·1 cites·14 claims
- 0344US2025218920A1Apparatus formed from electronic components having different respective thicknesses and methods of forming an apparatus from electronic components having different respective thicknessesMICROCHIP TECH INC·Filed 2024·Application pending·0 cites
- 0443US2025054914A1Method of alignment of electrical components of an electrical apparatus with a support assemblyMICROCHIP TECH INC·Filed 2024·Application pending·0 cites
- 0542US2024421019A1Electronic package with redistribution layer plate formed via temporary plugMICROCHIP TECH INC·Filed 2023·Application pending·0 cites
- 0642US2024421230A1ELECTRONIC DEVICES WITH SUBSTRATES LESS THAN 50 µm THICK AND METHODS OF MANUFACTUREMICROCHIP TECH INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →