Inventor · disambiguated record
Man K. Lam
Also filed as: LAM MAN K · LAM MAN KIT
8 granted patents·1 pending application·269 citations·filing 1980–2018
87Inventor score
Top patents by PatentIndex Score
9 records- 0190US5137836AMethod of manufacturing a repairable multi-chip moduleATMEL CORP·Filed 1991·Granted Aug 11, 1992·144 cites·18 claims
- 0281US4942383ALow cost wet-to-wet pressure sensor packageHONEYWELL INC·Filed 1989·Granted Jul 17, 1990·46 cites·15 claims
- 0366US5138115ACarrierles surface mounted integrated circuit dieATMEL CORP·Filed 1991·Granted Aug 11, 1992·40 cites·15 claims
- 0465US10903148B2High performance multi-component electronics power moduleMICROCHIP TECH INC·Filed 2018·Granted Jan 26, 2021·1 cites·13 claims
- 0556US5079835AMethod of forming a carrierless surface mounted integrated circuit dieATMEL CORP·Filed 1990·Granted Jan 14, 1992·27 cites·14 claims
- 0644US10553524B2Integrated circuit (IC) die attached between an offset lead frame die-attach pad and a discrete die-attach padMICROCHIP TECH INC·Filed 2018·Granted Feb 4, 2020·0 cites·20 claims
- 0739US2019131247A1Semiconductor Wafer Cutting Using A Polymer Coating To Reduce Physical DamageMICROCHIP TECH INC·Filed 2018·Application pending·0 cites
- 0837US5031462ASnap-fit construction low cost pressure sensing deviceHONEYWELL INC·Filed 1989·Granted Jul 16, 1991·8 cites·9 claims
- 0929US4295271AMethod of soldering a lead to a sintered lead padHONEYWELL INF SYSTEMS·Filed 1980·Granted Oct 20, 1981·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →