Inventor · disambiguated record
Mark Larsen
Also filed as: LARSEN MARK · LARSEN MARK A
5 granted patents·69 citations·filing 1991–2011
79Inventor score
Top patents by PatentIndex Score
5 records- 0179US8058732B2Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2008·Granted Nov 15, 2011·10 cites·33 claims
- 0273US7960800B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jun 14, 2011·5 cites·13 claims
- 0372US8598035B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2011·Granted Dec 3, 2013·3 cites·10 claims
- 0466US5182880ADoor frame cladding apparatusNEW MORNING WINDOWS INC·Filed 1991·Granted Feb 2, 1993·48 cites·2 claims
- 0561US8072027B23D channel architecture for semiconductor devicesKIM SUKU·Filed 2009·Granted Dec 6, 2011·3 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →