Inventor · disambiguated record
Markus Lasch
Also filed as: LASCH MARKUS
2 granted patents·3 pending applications·0 citations·filing 2020–2022
24Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0153US12482739B2Arrangement for a semiconductor arrangement comprising at least one passive component and a substrateSIEMENS AG·Filed 2022·Granted Nov 25, 2025·0 cites·15 claims
- 0253US12082333B2Electronic module, method for producing an electronic module, and industrial plantSIEMENS AG·Filed 2021·Granted Sep 3, 2024·0 cites·9 claims
- 0342US2023207516A1Method for Welding an Attachment Piece to a Semiconductor Metallisation by Laser WeldingSIEMENS AG·Filed 2021·Application pending·0 cites
- 0439US2022359342A1Securing power semiconductor components to curved surfacesROLLS ROYCE DEUTSCHLAND LTD & CO KG·Filed 2020·Application pending·0 cites
- 0539US2022254652A1Securing power semiconductor components to curved surfacesSIEMENS AG·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →