Inventor · disambiguated record
Mark Lefebvre
Also filed as: LEFEBVRE MARK · LEFEBVRE MARK C
20 granted patents·14 pending applications·249 citations·filing 1999–2023
94Inventor score
Top patents by PatentIndex Score
34 records- 0194US8048284B2Metal plating compositionsROHM & HAAS ELECT MAT·Filed 2008·Granted Nov 1, 2011·17 cites·4 claims
- 0293US6444110B2Electrolytic copper plating methodSHIPLEY CO LLC·Filed 1999·Granted Sep 3, 2002·86 cites·46 claims
- 0391US6689711B2Methods of producing oxygen reduction catalystMETALLIC POWER INC·Filed 2001·Granted Feb 10, 2004·45 cites·64 claims
- 0490US9809892B1Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indiumROHM & HAAS ELECT MAT·Filed 2016·Granted Nov 7, 2017·4 cites·6 claims
- 0590US8012334B2Metal plating compositions and methodsROHM & HAAS ELECT MAT·Filed 2008·Granted Sep 6, 2011·10 cites·3 claims
- 0689US8329018B2Metal plating compositions and methodsREDDINGTON ERIK·Filed 2011·Granted Dec 11, 2012·7 cites·6 claims
- 0785US6531046B2Seed layer repair methodSHIPLEY CO LLC·Filed 2000·Granted Mar 11, 2003·44 cites·20 claims
- 0884US8337688B2Metal plating compositionsREDDINGTON ERIK·Filed 2011·Granted Dec 25, 2012·7 cites·5 claims
- 0971US6660153B2Seed layer repair bathSHIPLEY CO LLC·Filed 2001·Granted Dec 9, 2003·15 cites·15 claims
- 1070US8956523B2Metal plating compositions and methodsREDDINGTON ERIK·Filed 2012·Granted Feb 17, 2015·1 cites·1 claims
- 1166US8198120B2Optical articleGOELA JITENDRA S·Filed 2009·Granted Jun 12, 2012·2 cites·9 claims
- 1263US6660154B2Seed layerSHIPLEY CO LLC·Filed 2001·Granted Dec 9, 2003·9 cites·18 claims
- 1362US9932684B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxidesROHM & HAAS ELECT MAT·Filed 2016·Granted Apr 3, 2018·1 cites·8 claims
- 1460US8716824B2Article having electrically conductive and selectively passivated patternsGOELA JITENDRA S·Filed 2009·Granted May 6, 2014·1 cites·6 claims
- 1553US10006136B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compoundsROHM & HAAS ELECT MAT·Filed 2016·Granted Jun 26, 2018·0 cites·8 claims
- 1653US2024330404A1Systems and methods for providing synthetic dataOPTUM INC·Filed 2023·Application pending·0 cites
- 1752US9809891B2Plating methodROHM & HAAS ELECT MAT·Filed 2014·Granted Nov 7, 2017·0 cites·11 claims
- 1849US2006065537A1Electrolytic copper plating solutionsBARSTAD LEON R·Filed 2005·Application pending·0 cites
- 1947US2016121977A1Floatation accessory device for an e-reading deviceKOBO INC·Filed 2014·Application pending·0 cites
- 2044US10428436B2Indium electroplating compositions containing amine compounds and methods of electroplating indiumROHM & HAAS ELECT MAT·Filed 2017·Granted Oct 1, 2019·0 cites·4 claims
- 2144US2015100922A1Method and system for displaying user-specific information on-screen contemporaneously with an animated widgetKOBO INC·Filed 2013·Application pending·0 cites
- 2243US2018016690A1Indium electroplating compositions containing 2-imidazolidinethione compounds and methods for electroplating indiumROHM & HAAS ELECT MAT·Filed 2017·Application pending·0 cites
- 2341US2005145968A1Optical articleROHM & HAAS ELECT MAT·Filed 2004·Application pending·0 cites
- 2441US2017145577A1Method of electroplating low internal stress copper deposits on thin film substrates to inhibit warpingROHM & HAAS ELECT MAT·Filed 2016·Application pending·0 cites
- 2540US10100421B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compoundsROHM & HAAS ELECT MAT·Filed 2016·Granted Oct 16, 2018·0 cites·8 claims
- 2640US10104782B2Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxidesROHM & HAAS ELECT MAT·Filed 2016·Granted Oct 16, 2018·0 cites·8 claims
- 2740US2018016689A1Indium electroplating compositions and methods for electroplating indiumROHM & HAAS ELECT MAT·Filed 2016·Application pending·0 cites
- 2840US2004084399A1Process of producing printed circuit boards and the circuit boards formed therebySHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2940US2006183328A1Electrolytic copper plating solutionsBARSTAD LEON R·Filed 2005·Application pending·0 cites
- 3040US2003010646A1Electrolytic copper plating solutionsFiled 2002·Application pending·0 cites
- 3138US2017067173A1Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper depositsROHM & HAAS ELECT MAT·Filed 2016·Application pending·0 cites
- 3235US2002090484A1Plating bathSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 3332US9365943B2Method of electroplating uniform copper layersNAJJAR ELIE H·Filed 2011·Granted Jun 14, 2016·0 cites·3 claims
- 3432US2016312372A1Acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper depositsROHM & HAAS ELECT MAT·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →