Inventor · disambiguated record
Martin Lim
Also filed as: LIM MARTIN · LIM MARTIN G · LIM MARTIN GEORGE
71 granted patents·12 pending applications·1,316 citations·filing 1993–2025
99Inventor score
Top patents by PatentIndex Score
83 records- 0199US7250353B2Method and system of releasing a MEMS structureINVENSENSE INC·Filed 2005·Granted Jul 31, 2007·135 cites·8 claims
- 0298US10488274B2Acoustic ambient temperature and humidity sensingINVENSENSE INC·Filed 2018·Granted Nov 26, 2019·17 cites·17 claims
- 0398US9933319B2Acoustic ambient temperature and humidity sensingINVENSENSE INC·Filed 2015·Granted Apr 3, 2018·20 cites·7 claims
- 0498US8692340B1MEMS acoustic sensor with integrated back cavityINVENSENSE INC·Filed 2013·Granted Apr 8, 2014·54 cites·23 claims
- 0598US8564076B1Internal electrical contact for enclosed MEMS devicesINVENSENSE INC·Filed 2013·Granted Oct 22, 2013·40 cites·18 claims
- 0698US8513747B1Integrated MEMS devices with controlled pressure environments by means of enclosed volumesINVENSENSE INC·Filed 2012·Granted Aug 20, 2013·44 cites·14 claims
- 0798US8350346B1Integrated MEMS devices with controlled pressure environments by means of enclosed volumesINVENSENSE INC·Filed 2012·Granted Jan 8, 2013·101 cites·22 claims
- 0897US7458263B2Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packagingINVENSENSE INC·Filed 2005·Granted Dec 2, 2008·88 cites·27 claims
- 0997US5565113ALithographically defined ejection unitsXEROX CORP·Filed 1994·Granted Oct 15, 1996·138 cites·3 claims
- 1096US11884535B2Device, package structure and manufacturing method of deviceXMEMS LABS INC·Filed 2022·Granted Jan 30, 2024·4 cites·24 claims
- 1196US11399228B2Acoustic transducer, wearable sound device and manufacturing method of acoustic transducerXMEMS LABS INC·Filed 2021·Granted Jul 26, 2022·13 cites·15 claims
- 1296US11323797B2Acoustic transducer, wearable sound device and manufacturing method of acoustic transducerXMEMS LABS INC·Filed 2021·Granted May 3, 2022·14 cites·23 claims
- 1396US8395381B2Micromachined magnetic field sensorsLO CHIUNG C·Filed 2010·Granted Mar 12, 2013·45 cites·15 claims
- 1495US9114977B2MEMS device and process for RF and low resistance applicationsINVENSENSE INC·Filed 2012·Granted Aug 25, 2015·12 cites·18 claims
- 1594US9452925B2Method of increasing MEMS enclosure pressure using outgassing materialINVENSENSE INC·Filed 2015·Granted Sep 27, 2016·8 cites·1 claims
- 1693US10598621B2Gas sensing device with chemical and thermal conductivity sensingINVENSENSE INC·Filed 2017·Granted Mar 24, 2020·8 cites·12 claims
- 1792US9556019B2Cavity pressure modification using local heating with a laserINVENSENSE INC·Filed 2015·Granted Jan 31, 2017·5 cites·19 claims
- 1892US8384134B2MEMS device including an electrical interconnect through a substrateINVENSENSE INC·Filed 2012·Granted Feb 26, 2013·11 cites·18 claims
- 1991US9809448B2Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the sameINVENSENSE INC·Filed 2015·Granted Nov 7, 2017·9 cites·16 claims
- 2091US9428379B2MEMS acoustic sensor with integrated back cavityINVENSENSE INC·Filed 2014·Granted Aug 30, 2016·8 cites·13 claims
- 2190US10783866B1Sound producing deviceXMEMS LABS INC·Filed 2020·Granted Sep 22, 2020·3 cites·30 claims
- 2290US10221065B2CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufactureINVENSENSE INC·Filed 2017·Granted Mar 5, 2019·4 cites·15 claims
- 2389US5631678AAcoustic printheads with optical alignmentXEROX CORP·Filed 1994·Granted May 20, 1997·62 cites·1 claims
- 2487US6189381B1Angular rate sensor made from a structural wafer of single crystal siliconSITEK INC·Filed 1999·Granted Feb 20, 2001·125 cites·4 claims
- 2586US12157663B2Venting device, manufacturing method of venting device, venting method and deviceXMEMS LABS INC·Filed 2024·Granted Dec 3, 2024·1 cites·27 claims
- 2686US11366193B2Method of setting a measurement instrument and system for setting a measurement instrumentROHDE & SCHWARZ·Filed 2019·Granted Jun 21, 2022·3 cites·12 claims
- 2786US9738512B2CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufactureINVENSENSE INC·Filed 2015·Granted Aug 22, 2017·3 cites·8 claims
- 2886US9302902B2Integrated heater on MEMS cap for wafer scale packaged MEMS sensorsINVENSENSE INC·Filed 2014·Granted Apr 5, 2016·6 cites·18 claims
- 2985US9796580B2CMOS-MEMS-CMOS platformINVENSENSE INC·Filed 2015·Granted Oct 24, 2017·4 cites·11 claims
- 3085US9650241B2Method for providing a MEMS device with a plurality of sealed enclosures having uneven standoff structures and MEMS device thereofINVENSENSE INC·Filed 2015·Granted May 16, 2017·4 cites·18 claims
- 3185US8686555B2Integrated heater on MEMS cap for wafer scale packaged MEMS sensorsYARALIOGLU GOKSEN G·Filed 2012·Granted Apr 1, 2014·9 cites·20 claims
- 3284US5428381ACapping structureXEROX CORP·Filed 1993·Granted Jun 27, 1995·49 cites·4 claims
- 3383US9731963B2Method of increasing MEMS enclosure pressure using outgassing materialINVENSENSE INC·Filed 2016·Granted Aug 15, 2017·2 cites·11 claims
- 3483US6187211B1Method for fabrication of multi-step structures using embedded etch stop layersXEROX CORP·Filed 1998·Granted Feb 13, 2001·53 cites·22 claims
- 3582US9802815B2Method for MEMS structure with dual-level structural layer and acoustic portINVENSENSE INC·Filed 2015·Granted Oct 31, 2017·4 cites·9 claims
- 3682US8945969B2Internal electrical contact for enclosed MEMS devicesINVENSENSE INC·Filed 2014·Granted Feb 3, 2015·2 cites·9 claims
- 3782US8822252B2Internal electrical contact for enclosed MEMS devicesINVENSENSE INC·Filed 2013·Granted Sep 2, 2014·3 cites·13 claims
- 3882US5821958AAcoustic ink printhead with variable size droplet ejection openingsXEROX CORP·Filed 1995·Granted Oct 13, 1998·44 cites·3 claims
- 3981US10935509B2Gas sensing method with chemical and thermal conductivity sensingINVENSENSE INC·Filed 2020·Granted Mar 2, 2021·1 cites·12 claims
- 4081US9809451B2Capacitive sensing structure with embedded acoustic channelsINVENSENSE INC·Filed 2015·Granted Nov 7, 2017·2 cites·19 claims
- 4180US9216897B2Capacitive sensing structure with embedded acoustic channelsINVENSENSE INC·Filed 2013·Granted Dec 22, 2015·3 cites·21 claims
- 4279US9617144B2Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating sameINVENSENSE INC·Filed 2014·Granted Apr 11, 2017·4 cites·10 claims
- 4379US6549107B2Latching mechanism for MEMS actuator and method of fabricationOPTICNET INC·Filed 2001·Granted Apr 15, 2003·23 cites·7 claims
- 4479US6477290B1Fiber optic switch using MEMSOPTIC NET INC·Filed 2000·Granted Nov 5, 2002·25 cites·13 claims
- 4578US6865313B2Bistable latching actuator for optical switching applicationsOPTICNET INC·Filed 2003·Granted Mar 8, 2005·20 cites·33 claims
- 4677US9540230B2Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressuresDANEMAN MICHAEL·Filed 2012·Granted Jan 10, 2017·3 cites·6 claims
- 4776US10891461B2Live fingerprint detection utilizing an integrated ultrasound and infrared sensorINVENSENSE INC·Filed 2017·Granted Jan 12, 2021·3 cites·28 claims
- 4871US9344808B2Differential sensing acoustic sensorINVENSENSE INC·Filed 2014·Granted May 17, 2016·3 cites·30 claims
- 4969US10850973B2Methods for CMOS-MEMS integrated devices with multiple sealed cavities maintained at various pressuresINVENSENSE INC·Filed 2019·Granted Dec 1, 2020·0 cites·19 claims
- 5069US10343897B2Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating sameINVENSENSE INC·Filed 2017·Granted Jul 9, 2019·1 cites·17 claims
Showing the top 50 of 83 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Martin Lim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →