Inventor · disambiguated record
Martin Liu
Also filed as: LIU MARTIN
16 granted patents·74 citations·filing 2008–2023
92Inventor score
Files withLIU MARTIN4TAIWAN SEMICONDUCTOR MFG CO LTD4HSIEH YUAN-CHIH3GUANGZHOU HOMFEL LTD2TAIWAN SEMICONDUCTOR MFG2
Top patents by PatentIndex Score
16 records- 0196US11869971B2Multi-bit memory storage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 9, 2024·2 cites·20 claims
- 0296US11848381B2Methods of operating multi-bit memory storage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·20 claims
- 0396US11532746B2Multi-bit memory storage device and method of operating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·5 cites·20 claims
- 0492US8647962B2Wafer level packaging bondLIU MARTIN·Filed 2010·Granted Feb 11, 2014·14 cites·13 claims
- 0590US8207595B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2010·Granted Jun 26, 2012·9 cites·14 claims
- 0684US8648468B2Hermetic wafer level packagingCHU RICHARD·Filed 2010·Granted Feb 11, 2014·7 cites·18 claims
- 0784US8598687B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2012·Granted Dec 3, 2013·5 cites·19 claims
- 0882US12355026B2Method of writing to or erasing multi-bit memory storage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0981US8445380B2Semiconductor having a high aspect ratio viaHSIEH YUAN-CHIH·Filed 2012·Granted May 21, 2013·4 cites·20 claims
- 1079US8851133B2Method and apparatus of holding a deviceLIU MARTIN·Filed 2009·Granted Oct 7, 2014·7 cites·20 claims
- 1177US8173518B2Method of wafer bondingLIU MARTIN·Filed 2009·Granted May 8, 2012·8 cites·20 claims
- 1264US8048807B2Method and apparatus for thinning a substrateTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 1, 2011·2 cites·19 claims
- 1363US8964413B2Two stage resonant converter enabling soft-switching in an isolated stageLIU MARTIN·Filed 2010·Granted Feb 24, 2015·2 cites·23 claims
- 1458USD915712SDustbinGUANGZHOU HOMFEL LTD·Filed 2019·Granted Apr 6, 2021·6 cites·1 claims
- 1558US10323790B2Rotary suction cupGUANGZHOU HOMFEL LTD·Filed 2018·Granted Jun 18, 2019·1 cites·12 claims
- 1654US9337168B2Hermetic wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →