Inventor · disambiguated record
Mario Lowack
Also filed as: LOWACK MARIO
1 granted patent·2 pending applications·0 citations·filing 2018–2024
1Inventor score
Files withPVA TEPLA ANALYTICAL SYSTEMS GMBH3
Top patents by PatentIndex Score
3 records- 0150US2025110086A1Transducer attachment body for a probe, having at least one transducer and one lens, of an acoustic microscope, an acoustic microscope, and method of performing an ultra-sound scanning microscopyPVA TEPLA ANALYTICAL SYSTEMS GMBH·Filed 2024·Application pending·0 cites
- 0233US2022328341A1Wafer chuck for handling a waferPVA TEPLA ANALYTICAL SYSTEMS GMBH·Filed 2022·Application pending·0 cites
- 0319US12510644B2Ultrasonic microscope and carrier for carrying an acoustic pulse transducerPVA TEPLA ANALYTICAL SYSTEMS GMBH·Filed 2018·Granted Dec 30, 2025·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →