Inventor · disambiguated record
Masataka Maehara
Also filed as: MAEHARA MASATAKA
12 granted patents·3 pending applications·21 citations·filing 2004–2023
85Inventor score
Top patents by PatentIndex Score
15 records- 0181US11676929B2Electronic substrate and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Jun 13, 2023·1 cites·16 claims
- 0269US7584535B2Method of manufacturing multi-layer wiring boardTOPPAN PRINTING CO LTD·Filed 2007·Granted Sep 8, 2009·5 cites·17 claims
- 0367US2023275058A1Electronic substrate and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 0466US10910289B2Electronic substrate and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Feb 2, 2021·1 cites·15 claims
- 0559US11584909B2Cell potential detection device, method of manufacturing cell potential detection device, and information processing systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Feb 21, 2023·0 cites·17 claims
- 0656US11391720B2Cell potential detection apparatus, method for manufacturing cell potential detection apparatus, and information processing systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jul 19, 2022·0 cites·10 claims
- 0756USD925532STouch panelSMK KK·Filed 2019·Granted Jul 20, 2021·6 cites·1 claims
- 0854US9461082B2Solid state imaging apparatus and method of producing the sameSONY CORP·Filed 2014·Granted Oct 4, 2016·0 cites·15 claims
- 0952US12085455B2Measurement device and measurement systemSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Sep 10, 2024·0 cites·19 claims
- 1049US10461111B2Solid state imaging apparatus and method of producing the sameSONY CORP·Filed 2016·Granted Oct 29, 2019·0 cites·18 claims
- 1144USD611434SLever push switchSMK KK·Filed 2009·Granted Mar 9, 2010·5 cites·1 claims
- 1243US2010032271A1SwitchSMK KK·Filed 2009·Application pending·0 cites
- 1340US7211757B2Push slide switchSMK KK·Filed 2005·Granted May 1, 2007·0 cites·18 claims
- 1437USD602443SSwitchSMK KK·Filed 2009·Granted Oct 20, 2009·3 cites·1 claims
- 1536US2004178492A1Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring boardTOPPAN PRINTING CO LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →