Inventor · disambiguated record
Marcantonio Mangiagli
Also filed as: MANGIAGLI MARCANTONIO
5 granted patents·85 citations·filing 1992–1995
82Inventor score
Technology areasH10W
Files withCONS RIC MICROELETTRONICA5
Top patents by PatentIndex Score
5 records- 0161US5766985AProcess for encapsulating a semiconductor device having a heat sinkCONS RIC MICROELETTRONICA·Filed 1995·Granted Jun 16, 1998·30 cites·18 claims
- 0255US5514913AResin-encapsulated semiconductor device having improved adhesionCONS RIC MICROELETTRONICA·Filed 1992·Granted May 7, 1996·23 cites·26 claims
- 0349US6320258B1Semiconductor device having alternating electrically insulative coated leadsCONS RIC MICROELETTRONICA·Filed 1994·Granted Nov 20, 2001·21 cites·16 claims
- 0435US5888889AIntegrated structure pad assembly for lead bondingCONS RIC MICROELETTRONICA·Filed 1995·Granted Mar 30, 1999·5 cites·23 claims
- 0534US5592026AIntegrated structure pad assembly for lead bondingCONS RIC MICROELETTRONICA·Filed 1994·Granted Jan 7, 1997·6 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →