Inventor · disambiguated record
Mauro Marchi
Also filed as: MARCHI MAURO
8 granted patents·1 pending application·94 citations·filing 2002–2012
86Inventor score
Top patents by PatentIndex Score
9 records- 0191US7270003B2BMEMS-type high-sensitivity inertial sensor and manufacturing process thereofST MICROELECTRONICS SRL·Filed 2005·Granted Sep 18, 2007·35 cites·17 claims
- 0289US7437933B2Micro-electro-mechanical structure having electrically insulated regions and manufacturing process thereofST MICROELECTRONICS SRL·Filed 2005·Granted Oct 21, 2008·30 cites·35 claims
- 0376US7399652B2Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtainedST MICROELECTRONICS SRL·Filed 2004·Granted Jul 15, 2008·18 cites·15 claims
- 0470US8193550B2Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtainedSASSOLINI SIMONE·Filed 2008·Granted Jun 5, 2012·4 cites·16 claims
- 0570US7800234B2Process for manufacturing deep through vias in a semiconductor device, and semiconductor device made therebyST MICROELECTRONICS SRL·Filed 2006·Granted Sep 21, 2010·5 cites·37 claims
- 0654US7595223B2Process for bonding and electrically connecting microsystems integrated in several distinct substratesST MICROELECTRONICS SRL·Filed 2007·Granted Sep 29, 2009·1 cites·24 claims
- 0751US7116525B2Read/write assembly for magnetic hard disksST MICROELECTRONICS SRL·Filed 2003·Granted Oct 3, 2006·1 cites·27 claims
- 0850US8679887B2Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtainedSASSOLINI SIMONE·Filed 2012·Granted Mar 25, 2014·0 cites·20 claims
- 0934US2003109183A1Process for bonding and electrically connecting microsystems integrated in several distinct substratesST MICROELECTRONICS SRL·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →