Inventor · disambiguated record
Masachika Masuda
Also filed as: MASUDA MASACHIKA
85 granted patents·7 pending applications·2,740 citations·filing 1986–2016
99Inventor score
Files withHITACHI LTD44DAINIPPON PRINTING CO LTD10RENESAS TECH CORP10MASUDA MASACHIKA6ELPIDA MEMORY INC5
Top patents by PatentIndex Score
92 records- 0198US7633146B2Semiconductor device and a method of manufacturing the sameELPIDA MEMORY INC·Filed 2008·Granted Dec 15, 2009·79 cites·8 claims
- 0298US6555918B2Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 2002·Granted Apr 29, 2003·188 cites·9 claims
- 0398US4862246ASemiconductor device lead frame with etched through holesHITACHI LTD·Filed 1988·Granted Aug 29, 1989·305 cites·7 claims
- 0497US7061105B2Semiconductor device and a method of manufacturing the sameAKITA ELECTRONICS SYSTEMS CO L·Filed 2003·Granted Jun 13, 2006·117 cites·26 claims
- 0597US6538331B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2001·Granted Mar 25, 2003·135 cites·10 claims
- 0696US7348668B2Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2006·Granted Mar 25, 2008·24 cites·21 claims
- 0796US6686663B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2002·Granted Feb 3, 2004·74 cites·15 claims
- 0895US7233058B2Memory card with an adaptorRENESAS TECH CORP·Filed 2005·Granted Jun 19, 2007·25 cites·60 claims
- 0994US6337521B1Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2000·Granted Jan 8, 2002·83 cites·18 claims
- 1093US7294918B2Memory card with connecting portions for connection to an adapterRENESAS TECH CORP·Filed 2006·Granted Nov 13, 2007·19 cites·35 claims
- 1192US7053471B2Memory cardHITACHI ULSI SYS CO LTD·Filed 2002·Granted May 30, 2006·44 cites·49 claims
- 1292US6853089B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Feb 8, 2005·83 cites·29 claims
- 1392US6492727B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Dec 10, 2002·55 cites·7 claims
- 1492US6452266B1Semiconductor deviceHITACHI LTD·Filed 2001·Granted Sep 17, 2002·61 cites·1 claims
- 1592US6252299B1Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 1998·Granted Jun 26, 2001·98 cites·7 claims
- 1691US6602734B1Method of manufacturing a semiconductor deviceHITACHI LTD·Filed 2000·Granted Aug 5, 2003·49 cites·10 claims
- 1789US6858925B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Feb 22, 2005·35 cites·4 claims
- 1889US4994411AProcess of producing semiconductor deviceHITACHI LTD·Filed 1989·Granted Feb 19, 1991·87 cites·15 claims
- 1988US8420446B2Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit memberYO SHIMAZAKI·Filed 2011·Granted Apr 16, 2013·22 cites·11 claims
- 2087US8739401B2Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit memberSHIMAZAKI YO·Filed 2010·Granted Jun 3, 2014·12 cites·7 claims
- 2187US8653647B2Plastic package and method of fabricating the sameMASUDA MASACHIKA·Filed 2010·Granted Feb 18, 2014·8 cites·18 claims
- 2287US6433421B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Aug 13, 2002·64 cites·5 claims
- 2385US5811877ASemiconductor device structureHITACHI LTD·Filed 1997·Granted Sep 22, 1998·84 cites·26 claims
- 2485US5150193AResin-encapsulated semiconductor device having a particular mounting structureHITACHI LTD·Filed 1991·Granted Sep 22, 1992·107 cites·28 claims
- 2584US7365441B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodDAINIPPON PRINTING CO LTD·Filed 2006·Granted Apr 29, 2008·15 cites·3 claims
- 2684US6924547B2Memory cardRENESAS TECH CORP·Filed 2003·Granted Aug 2, 2005·37 cites·14 claims
- 2784US6169325B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 2, 2001·82 cites·12 claims
- 2883US6531773B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Mar 11, 2003·26 cites·41 claims
- 2983US6410987B1Semiconductor device and a method of manufacturing the same and an electronic deviceHITACHI LTD·Filed 1999·Granted Jun 25, 2002·65 cites·12 claims
- 3081US7405468B2Plastic package and method of fabricating the sameDAINIPPON PRINTING CO LTD·Filed 2004·Granted Jul 29, 2008·24 cites·4 claims
- 3181US4989068ASemiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1989·Granted Jan 29, 1991·57 cites·45 claims
- 3280US7879647B2Semiconductor device and a method of manufacturing the sameELPIDA MEMORY INC·Filed 2009·Granted Feb 1, 2011·3 cites·14 claims
- 3380US6383845B2Stacked semiconductor device including improved lead frame arrangementHITACHI LTD·Filed 2001·Granted May 7, 2002·20 cites·8 claims
- 3479US7239011B2Memory card with a cap having indented portionsRENESAS TECH CORP·Filed 2005·Granted Jul 3, 2007·5 cites·63 claims
- 3578US8247888B2Semiconductor device and method for manufacturing metallic shielding plateMASUDA MASACHIKA·Filed 2010·Granted Aug 21, 2012·5 cites·13 claims
- 3678US6750080B2Semiconductor device and process for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Jun 15, 2004·24 cites·9 claims
- 3777US9263374B2Semiconductor device and manufacturing method thereforMASUDA MASACHIKA·Filed 2011·Granted Feb 16, 2016·5 cites·38 claims
- 3877US5895969AThin type semiconductor device, module structure using the device and method of mounting the device on boardHITACHI LTD AND HITACHI VLSI E·Filed 1997·Granted Apr 20, 1999·45 cites·36 claims
- 3976US7227251B2Semiconductor device and a memory system including a plurality of IC chips in a common packageELPIDA MEMORY INC·Filed 2005·Granted Jun 5, 2007·6 cites·10 claims
- 4076US7064011B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodNITTO DENKO CORP·Filed 2004·Granted Jun 20, 2006·21 cites·9 claims
- 4175US8742554B2Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit memberSHIMAZAKI YO·Filed 2006·Granted Jun 3, 2014·7 cites·15 claims
- 4273US8159062B2Semiconductor and a method of manufacturing the sameMASUDA MASACHIKA·Filed 2011·Granted Apr 17, 2012·1 cites·20 claims
- 4373US7271475B2Memory card with connecting portions for connection to an adapterRENESAS TECH CORP·Filed 2006·Granted Sep 18, 2007·3 cites·34 claims
- 4473US6501173B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Dec 31, 2002·14 cites·13 claims
- 4572US5723903AThin type semiconductor device, module structure using the device and method of mounting the device on boardHITACHI LTD·Filed 1995·Granted Mar 3, 1998·35 cites·18 claims
- 4670US6097081ASemiconductor device having adhesive between lead and chipHITACHI LTD·Filed 1998·Granted Aug 1, 2000·37 cites·36 claims
- 4768US8471371B2Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor deviceBABA SUSUMU·Filed 2010·Granted Jun 25, 2013·3 cites·8 claims
- 4868US4987474ASemiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1990·Granted Jan 22, 1991·41 cites·60 claims
- 4967US6617196B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Sep 9, 2003·11 cites·2 claims
- 5066US6388318B1Surface mount-type package of ball grid array with multi-chip mountingHITACHI LTD·Filed 2000·Granted May 14, 2002·11 cites·16 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →