Inventor · disambiguated record
Martin Mayer
Also filed as: MAYER MARTIN · MAYER MARTIN K · MAYER MARTIN RICHARD
13 granted patents·11 pending applications·16 citations·filing 2001–2024
87Inventor score
Files withMAN SERVICES GROUP INC8INFINEON TECHNOLOGIES AG7INFINEON TECHNOLOGIES AUSTRIA AG5ADVANCED DIGITAL LOGIC INC1INFINEON TECHOLOGIES AG1
Top patents by PatentIndex Score
24 records- 0197US11281813B1Methods and apparatus for authenticating an encryption key stored in removable memory devices, to access a compute deviceMAN SERVICES GROUP INC·Filed 2021·Granted Mar 22, 2022·7 cites·17 claims
- 0295US11210446B1Isolation of compartments in a layered printed circuit board, and apparatus and methods for the sameMAN SERVICES GROUP INC·Filed 2021·Granted Dec 28, 2021·3 cites·18 claims
- 0394US11580287B1Isolation of compartments in a layered printed circuit board, and apparatus and methods for the sameMAN SERVICES GROUP INC·Filed 2021·Granted Feb 14, 2023·2 cites·20 claims
- 0493US11741269B1Methods and apparatus for authenticating an encryption key stored in removable memory devices, to access a compute deviceMAN SERVICES GROUP INC·Filed 2022·Granted Aug 29, 2023·2 cites·20 claims
- 0588US12002724B2Power module with metal substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Jun 4, 2024·1 cites·7 claims
- 0684US12437139B1Isolation of compartments in a layered printed circuit board, and apparatus and methods for the sameMAN SERVICES GROUP INC·Filed 2024·Granted Oct 7, 2025·0 cites·22 claims
- 0782US12455989B1Methods and apparatus for authenticating an encryption key stored in removable memory devices, to access a compute deviceMAN SERVICES GROUP INC·Filed 2024·Granted Oct 28, 2025·0 cites·20 claims
- 0879US12045379B1Methods and apparatus for authenticating an encryption key stored in removable memory devices, to access a compute deviceMAN SERVICES GROUP INC·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 0979US11404336B2Power module with metal substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Aug 2, 2022·1 cites·11 claims
- 1077US11972190B1Isolation of compartments in a layered printed circuit board, and apparatus and methods for the sameMAN SERVICES GROUP INC·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 1160US2024297111A1Carrier structure, package arrangement, method of forming a carrier structure, and method of forming a package arrangementINFINEON TECHOLOGIES AG·Filed 2024·Application pending·0 cites
- 1259US2024153885A1Semiconductor devices with electrical insulation features and associated production methodsINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1359US2024234227A9Semiconductor devices with embedded filler particles and associated methods for their productionINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1454US12237242B2Semiconductor device package comprising a thermal interface material with improved handling propertiesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Granted Feb 25, 2025·0 cites·16 claims
- 1553US2022359432A1Semiconductor package with a scratch protection layer and method of fabricationINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 1653US2023064442A1Chip package structure, chip package system, and method of forming a chip package structureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1752US2024030092A1Radio frequency devices including radio frequency absorbent featuresINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1852US2023014380A1Semiconductor Power Module with Two Different Potting Materials and a Method for Fabricating the SameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Application pending·0 cites
- 1947US2021166986A1Package with encapsulant under compressive stressINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 2046US11626351B2Semiconductor package with barrier to contain thermal interface materialINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 11, 2023·0 cites·15 claims
- 2145US2020227339A1Interface Material Having a Polymer CeramicINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 2236US7239514B2Heat transfer structure for electronic devicesADVANCED DIGITAL LOGIC INC·Filed 2005·Granted Jul 3, 2007·0 cites·7 claims
- 2334US2004036148A1Electric component, method for the production thereof, and its useFiled 2001·Application pending·0 cites
- 2433US2006026586A1Systems and methods for enabling functions in a computerized systemREMMEL JUERGEN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →