Inventor · disambiguated record
Mayank Mayukh
Also filed as: MAYUKH MAYANK
5 granted patents·15 pending applications·7 citations·filing 2011–2025
68Inventor score
Top patents by PatentIndex Score
20 records- 0191US11906802B2Photonics integration in semiconductor packagesAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Feb 20, 2024·2 cites·20 claims
- 0274US2025096108A1Cantilevered power planes to provide a return current path for high-speed signalsAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 0373US2024151921A1Photonics Integration in Semiconductor PackagesAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 0471US2025279341A1Multilayer Cores, Variable Width Vias, and Offset ViasAVAGO TECH INT SALES PTE LID·Filed 2025·Application pending·0 cites
- 0567US9505770B2Organic photovoltaic devices comprising solution-processed substituted metal-phthalocyanines and exhibiting near-IR photo-sensitivityMCGRATH DOMINIC V·Filed 2011·Granted Nov 29, 2016·5 cites·34 claims
- 0664US12191243B2Cantilevered power planes to provide a return current path for high-speed signalsAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 0762US2023352383A1Multilayer Cores, Variable Width Vias, and Offset ViasAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 0860US12463319B2Integrated antennas on side wall of 3D stacked dieAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Nov 4, 2025·0 cites·8 claims
- 0958US2025087560A1Structures and methods to maximize contact density across cavitiesAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 1056US2025029890A1Structure and method for integrating through metal contacts and fluid channelsAVAGO TECH INT SALES PTE LID·Filed 2023·Application pending·0 cites
- 1156US2025364474A1Barriers in seminconductor devicesAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 1253US2024145392A1Substrate with Differing Dielectric ConstantsAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 1352US2024128156A1Microfluidic Channels for Cooling Hybrid Bonded InterfacesAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 1452US2025046622A1Hybrid substrates and manufacturing methods thereofAVAGO TECH INT SALES PTE LID·Filed 2023·Application pending·0 cites
- 1552US2025046690A1Hybrid substrates and manufacturing methods thereofAVAGO TECH INT SALES PTE LID·Filed 2023·Application pending·0 cites
- 1651US2024038641A1Elastomer Interconnection Substrate LayerAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 1751US2024038645A1Semiconductor Package Interconnection StructureAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 1851US2024038613A1Edge Seal for Bonded Stacks of Different Size Semiconductor DevicesAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 1950US12438062B2Polymerized thermal interface material with surface modified liquid metal spheres and method of makingAVAGO TECH INT SALES PTE LID·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 2050US2023369267A13D Packaging Heterogeneous Area Array InterconnectionsAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →