Inventor · disambiguated record
Markus Menath
Also filed as: MENATH MARKUS
15 granted patents·2 pending applications·77 citations·filing 2003–2019
91Inventor score
Files withINFINEON TECHNOLOGIES AG10MENATH MARKUS3STECHER MATTHIAS2HESS REINHARD1INFINEON TECHNOLOGIES AUSTRIA AG1
Top patents by PatentIndex Score
17 records- 0196US9780161B2Transformer comprising a rounded coilINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 3, 2017·15 cites·19 claims
- 0294US10510626B2Method for use in manufacturing a semiconductor device dieINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 17, 2019·16 cites·20 claims
- 0391US9183977B2Method for fabricating a coil by way of a rounded trenchMENATH MARKUS·Filed 2012·Granted Nov 10, 2015·12 cites·16 claims
- 0488US9214424B2Method for producing a conductor lineSTECHER MATTHIAS·Filed 2012·Granted Dec 15, 2015·13 cites·22 claims
- 0586US8637967B2Method for fabricating a semiconductor chip and semiconductor chipMENATH MARKUS·Filed 2010·Granted Jan 28, 2014·9 cites·27 claims
- 0681US9981843B2Chip package and a method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 29, 2018·2 cites·20 claims
- 0776US8951915B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsHESS REINHARD·Filed 2012·Granted Feb 10, 2015·6 cites·14 claims
- 0875US9553021B2Method for processing a wafer and method for dicing a waferMENATH MARKUS·Filed 2012·Granted Jan 24, 2017·3 cites·15 claims
- 0959US8665054B2Semiconductor component with coreless transformerSTECHER MATTHIAS·Filed 2012·Granted Mar 4, 2014·1 cites·30 claims
- 1055US11077525B2Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamberINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·0 cites·31 claims
- 1153US11282805B2Silicon carbide devices and methods for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 1250US9553022B1Method for use in manufacturing a semiconductor device dieINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 24, 2017·0 cites·13 claims
- 1348US2017084468A1Method for processing a wafer and method for dicing a waferINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 1446US9576875B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 21, 2017·0 cites·11 claims
- 1545US10090192B2Method for producing a conductor lineINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Oct 2, 2018·0 cites·20 claims
- 1644US7289231B2Apparatus and method for determining physical properties of a mask blankINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 30, 2007·0 cites·18 claims
- 1744US2015380306A1Method for Forming a Vertical Electrical Conductive ConnectionINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →