Inventor · disambiguated record
Marko Mirkovic
Also filed as: MIRKOVIC MARKO
3 granted patents·2 pending applications·0 citations·filing 2012–2024
42Inventor score
Top patents by PatentIndex Score
5 records- 0176US12439528B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2024·Granted Oct 7, 2025·0 cites·13 claims
- 0260US2024309538A1Modular plating lineGreenSource Fabrication LLC·Filed 2024·Application pending·0 cites
- 0359US12245383B2Method of preparing a high density interconnect printed circuit board including microvias filled with copperATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Mar 4, 2025·0 cites·12 claims
- 0441US12063751B2Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit boardATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Aug 13, 2024·0 cites·19 claims
- 0538US2015289387A1Method for combined through-hole plating and via fillingATOTECH DEUTSCHLAND GMBH·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →