Inventor · disambiguated record
Matheus Trevisan Moreira
Also filed as: MOREIRA MATHEUS TREVISAN
0 granted patents·2 pending applications·0 citations·filing 2023–2024
Files withMETA PLATFORMS TECH LLC2
Top patents by PatentIndex Score
2 records- 0156US2025054910A1Systems and methods for three-dimensionally stacking systems on chip with face-to-face hybrid bondingMETA PLATFORMS TECH LLC·Filed 2023·Application pending·0 cites
- 0252US2024346221A1Circuits and methods for reducing the effects of variation in inter-die communication in 3d-stacked systemsMETA PLATFORMS TECH LLC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →