Inventor · disambiguated record
Mark P. Murray
Also filed as: MURRAY MARK · MURRAY MARK P · MURRAY MARK PETER
8 granted patents·3 pending applications·327 citations·filing 1997–2007
90Inventor score
Top patents by PatentIndex Score
11 records- 0193US6436814B1Interconnection structure and method for fabricating sameIBM·Filed 2000·Granted Aug 20, 2002·71 cites·17 claims
- 0289US6190237B1pH-buffered slurry and use thereof for polishingIBM·Filed 1997·Granted Feb 20, 2001·107 cites·19 claims
- 0382US6221775B1Combined chemical mechanical polishing and reactive ion etching processIBM·Filed 1998·Granted Apr 24, 2001·64 cites·26 claims
- 0479US6426558B1Metallurgy for semiconductor devicesIBM·Filed 2001·Granted Jul 30, 2002·28 cites·8 claims
- 0574US7052625B2Slurry and use thereof for polishingIBM·Filed 2001·Granted May 30, 2006·16 cites·20 claims
- 0672US6674168B1Single and multilevel reworkIBM·Filed 2003·Granted Jan 6, 2004·17 cites·20 claims
- 0771US6982227B2Single and multilevel reworkIBM·Filed 2003·Granted Jan 3, 2006·16 cites·6 claims
- 0861US6653737B2Interconnection structure and method for fabricating sameIBM·Filed 2002·Granted Nov 25, 2003·8 cites·14 claims
- 0950US2007275565A1Full removal of dual damascene metal levelCOONEY EDWARD C III·Filed 2007·Application pending·0 cites
- 1041US2005103743A1Slurry and use thereof for polishingIBM·Filed 2004·Application pending·0 cites
- 1141US2004245636A1Full removal of dual damascene metal levelIBM·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →