Inventor · disambiguated record
Marjorie Kay Myers
Also filed as: MYERS MARJORIE · MYERS MARJORIE K · MYERS MARJORIE KAY
15 granted patents·11 pending applications·36 citations·filing 1998–2023
89Inventor score
Files withTYCO ELECTRONICS CORP12TE CONNECTIVITY SOLUTIONS GMBH5TE CONNECTIVITY CORP2TE Connectivity Services Gmbh2WHITAKER CORP2
Top patents by PatentIndex Score
26 records- 0190US11548052B2Self-lubricating connectorTE Connectivity Services Gmbh·Filed 2020·Granted Jan 10, 2023·3 cites·14 claims
- 0278US12066336B2Isolated temperature sensing for hems contactsTE CONNECTIVITY SOLUTIONS GMBH·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0374US12508640B2Self-lubricating connectorTE CONNECTIVITY SOLUTIONS GMBH·Filed 2022·Granted Dec 30, 2025·0 cites·4 claims
- 0473US10154595B2Electrical components and methods and systems of manufacturing electrical componentsTYCO ELECTRONICS CORP·Filed 2015·Granted Dec 11, 2018·2 cites·19 claims
- 0566US9520668B2Method and apparatus for crimping an electrical terminal to an electrical wireTYCO ELECTRONICS CORP·Filed 2013·Granted Dec 13, 2016·5 cites·9 claims
- 0664US11714008B2Isolated temperature sensing for hems contactsTE CONNECTIVITY CORP·Filed 2019·Granted Aug 1, 2023·0 cites·19 claims
- 0763US11990698B2Terminal for flat flexible cable having structured dimplesTE CONNECTIVITY SOLUTIONS GMBH·Filed 2022·Granted May 21, 2024·0 cites·18 claims
- 0863US10361527B2Electrical terminal and device for forming a terminalTYCO ELECTRONICS CORP·Filed 2016·Granted Jul 23, 2019·2 cites·19 claims
- 0962US2025083563A1Charging health monitoring device and methodTE CONNECTIVITY SOLUTIONS GMBH·Filed 2023·Application pending·0 cites
- 1060US11362451B2Low insertion force contact and method of manufactureTE Connectivity Services Gmbh·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 1159US2014290058A1Method of manufacturing a circuit boardTYCO ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1257US9543679B2Electrical contact assemblyTYCO ELECTRONICS CORP·Filed 2013·Granted Jan 10, 2017·3 cites·26 claims
- 1357US2025079727A1Contact assembly and method of manufacturing a contact assemblyTE CONNECTIVITY SOLUTIONS GMBH·Filed 2023·Application pending·0 cites
- 1455US2014141548A1Method of manufacturing a metal clad circuit boardTYCO ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1554US11133614B2Low insertion force contact and method of manufactureTE CONNECTIVITY CORP·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 1653US9758858B2Methods of manufacturing a coated structure on a substrateTYCO ELECTRONICS CORP·Filed 2013·Granted Sep 12, 2017·0 cites·9 claims
- 1752US2014097002A1Electrical components and methods and systems of manufacturing electrical componentsTYCO ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1852US2015079421A1Electrical component and method for fabricating sameTYCO ELECTRONICS AMP GMBH·Filed 2013·Application pending·0 cites
- 1949US2013051018A1Metal clad circuit boardMOSTOLLER MATTHEW E·Filed 2011·Application pending·0 cites
- 2046US6802729B2Contact for error resistant coupling of electrical signalsWHITAKER CORP·Filed 2001·Granted Oct 12, 2004·7 cites·2 claims
- 2146US2014097003A1Electrical components and methods and systems of manufacturing electrical componentsTYCO ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 2245US7247030B2Bonded three dimensional laminate structureTYCO ELECTRONICS CORP·Filed 2004·Granted Jul 24, 2007·3 cites·18 claims
- 2344US6296499B1Contact for error resistant coupling of electrical signalsWHITAKER CORP·Filed 1998·Granted Oct 2, 2001·11 cites·25 claims
- 2442US2013048342A1Circuit boardMALSTROM CHARLES RANDALL·Filed 2011·Application pending·0 cites
- 2540US2015126026A1Electrical components and methods and systems of manufacturing electrical componentsTYCO ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2640US2007259541A1Electrical interconnection device having dielectric coated metal substrateTYCO ELECTRONICS CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →