Inventor · disambiguated record
Marni Nabors
Also filed as: NABORS MARNI
9 granted patents·11 pending applications·11 citations·filing 2017–2025
80Inventor score
Top patents by PatentIndex Score
20 records- 0189US12051692B2Integrated circuit structure with front side signal lines and backside power deliveryINTEL CORP·Filed 2021·Granted Jul 30, 2024·4 cites·22 claims
- 0284US11373999B2Deep trench via for three-dimensional integrated circuitINTEL CORP·Filed 2018·Granted Jun 28, 2022·3 cites·26 claims
- 0377US11068640B2Power shared cell architectureINTEL CORP·Filed 2017·Granted Jul 20, 2021·3 cites·25 claims
- 0475US11881452B2Device layer interconnectsINTEL CORP·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 0572US11410928B2Device layer interconnectsINTEL CORP·Filed 2018·Granted Aug 9, 2022·1 cites·11 claims
- 0669US12100705B2Deep trench via for three-dimensional integrated circuitINTEL CORP·Filed 2022·Granted Sep 24, 2024·0 cites·25 claims
- 0768US2025227968A1Integrated circuit structure with backside power deliveryINTEL CORP·Filed 2025·Application pending·0 cites
- 0867US2024355819A1Integrated circuit structure with front side signal lines and backside power deliveryINTEL CORP·Filed 2024·Application pending·0 cites
- 0961US2023197779A1Integrated circuit structure with backside power deliveryINTEL CORP·Filed 2021·Application pending·0 cites
- 1060US2025374603A1Jog reduction integration for nanoribbons of different widthsLI XIA·Filed 2024·Application pending·0 cites
- 1158US12419085B2Integrated circuit structures having backside gate tie-downINTEL CORP·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 1258US2025301729A1Integrated circuit structures having gate tie-down links for uniform grid metal gate and trench contact cutINTEL CORP·Filed 2024·Application pending·0 cites
- 1353US12476205B2Rectilinear seams between adjacent fields of a die for improved layout efficiencyINTEL CORP·Filed 2021·Granted Nov 18, 2025·0 cites·24 claims
- 1453US2025112167A1Semiconductor design lithographic seam implementation methodology for advanced technologiesINTEL CORP·Filed 2023·Application pending·0 cites
- 1553US2025311402A1Integrated circuit structures having contacts to links for uniform grid metal gate and trench contact cutINTEL CORP·Filed 2024·Application pending·0 cites
- 1652US2024113107A1Gate cut, with asymmetrical channel to gate cut spacingINTEL CORP·Filed 2022·Application pending·0 cites
- 1750US2024113177A1Stacked source or drain contact flyoverINTEL CORP·Filed 2022·Application pending·0 cites
- 1848US2025006591A1Standard-cell circuits to mitigate scaling-related parasiticsINTEL CORP·Filed 2023·Application pending·0 cites
- 1947US2025107243A1Integrated circuit devices with replica cells and filler cells for reducing local layout effectsINTEL CORP·Filed 2023·Application pending·0 cites
- 2043US11682664B2Standard cell architecture with power tracks completely inside a cellINTEL CORP·Filed 2019·Granted Jun 20, 2023·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →