Inventor · disambiguated record
Masatake Nagaya
Also filed as: NAGAYA MASATAKE
18 granted patents·11 pending applications·120 citations·filing 1995–2024
91Inventor score
Files withDENSO CORP24KOUTAKE KYOHEI1KWANSEI GAKUIN EDUCATIONAL FOUND1NIPPON DENSO CO1SHOWA DENKO KK1
Top patents by PatentIndex Score
29 records- 0194US11881407B2Processed wafer and method of manufacturing chip formation waferDENSO CORP·Filed 2021·Granted Jan 23, 2024·10 cites·5 claims
- 0278US6710435B2Semiconductor device arrangement and method of fabricating the sameDENSO CORP·Filed 2002·Granted Mar 23, 2004·26 cites·22 claims
- 0377US5851846APolishing method for SOINIPPON DENSO CO·Filed 1995·Granted Dec 22, 1998·57 cites·24 claims
- 0471US7763543B2Method for manufacturing silicon carbide semiconductor apparatusDENSO CORP·Filed 2008·Granted Jul 27, 2010·4 cites·11 claims
- 0569US11781244B2Seed crystal for single crystal 4H—SiC growth and method for processing the sameSHOWA DENKO KK·Filed 2018·Granted Oct 10, 2023·1 cites·7 claims
- 0665US2024141550A1Silicon carbide wafer manufacturing apparatusDENSO CORP·Filed 2023·Application pending·0 cites
- 0760US12476156B2Semiconductor chip and method for manufacturing the sameDENSO CORP·Filed 2022·Granted Nov 18, 2025·0 cites·4 claims
- 0859US12188151B2Silicon carbide wafer and method for manufacturing the sameDENSO CORP·Filed 2022·Granted Jan 7, 2025·0 cites·4 claims
- 0959US8758087B2Wafer processing method, wafer polishing apparatus, and ingot slicing apparatusKOUTAKE KYOHEI·Filed 2011·Granted Jun 24, 2014·2 cites·6 claims
- 1058US12494396B2Manufacturing method of semiconductor deviceDENSO CORP·Filed 2022·Granted Dec 9, 2025·0 cites·11 claims
- 1158US12293945B2Semiconductor chip and method for manufacturing the sameDENSO CORP·Filed 2022·Granted May 6, 2025·0 cites·9 claims
- 1257US11810783B2Gallium nitride semiconductor device and method for manufacturing the sameDENSO CORP·Filed 2021·Granted Nov 7, 2023·0 cites·8 claims
- 1355US12237378B2Method for manufacturing SiC substrateKWANSEI GAKUIN EDUCATIONAL FOUND·Filed 2020·Granted Feb 25, 2025·0 cites·12 claims
- 1455US2023197442A1Semiconductor device and method of manufacturing the sameDENSO CORP·Filed 2022·Application pending·0 cites
- 1555US2025201632A1Method for manufacturing semiconductor deviceDENSO CORP·Filed 2024·Application pending·0 cites
- 1654US6060344AMethod for producing a semiconductor substrateDENSO CORP·Filed 1998·Granted May 9, 2000·20 cites·33 claims
- 1753US12334339B2Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Granted Jun 17, 2025·0 cites·9 claims
- 1853US12288720B2Semiconductor chip, processed wafer, and method for manufacturing semiconductor chipDENSO CORP·Filed 2022·Granted Apr 29, 2025·0 cites·13 claims
- 1953US2024162092A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 2053US2024194530A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 2153US2023230829A1Semiconductor wafer processing apparatus and method of manufacturing semiconductor elementDENSO CORP·Filed 2022·Application pending·0 cites
- 2252US12139813B2SiC wafer and manufacturing method for SiC waferTOYOTA TSUSHO CORP·Filed 2019·Granted Nov 12, 2024·0 cites·4 claims
- 2352US2023238281A1Method of manufacturing gallium nitride substrateDENSO CORP·Filed 2023·Application pending·0 cites
- 2452US2024038590A1Semiconductor device and manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 2552US2024038711A1Semiconductor device and manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 2651US2024030056A1Manufacturing method of semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 2749US11784039B2Method for manufacturing gallium nitride semiconductor deviceDENSO CORP·Filed 2021·Granted Oct 10, 2023·0 cites·5 claims
- 2848US11810821B2Semiconductor chip and method for manufacturing the sameDENSO CORP·Filed 2021·Granted Nov 7, 2023·0 cites·6 claims
- 2938US2019035684A1Method for manufacturing silicon carbide semiconductor deviceDENSO CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →