Inventor · disambiguated record
Masakazu Nakabayashi
Also filed as: NAKABAYASHI MASAKAZU
9 granted patents·2 pending applications·168 citations·filing 1999–2003
89Inventor score
Top patents by PatentIndex Score
11 records- 0184US6461938B2Method of producing semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 8, 2002·31 cites·2 claims
- 0279US6383832B1Pressure responsive device and method of manufacturing semiconductor substrate for use in pressure responsive deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 7, 2002·44 cites·8 claims
- 0377US6738484B2Pressure responsive device and method of manufacturing semiconductor substrate for use in pressure responsive deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 18, 2004·26 cites·14 claims
- 0473US6215194B1Wafer sheet with adhesive on both sides and attached semiconductor waferMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 10, 2001·37 cites·10 claims
- 0565US6568269B2Acceleration sensor and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 27, 2003·12 cites·8 claims
- 0657US6784471B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Aug 31, 2004·6 cites·8 claims
- 0751US6564422B2Vacuum cleaner having a common valve to control multiple operationsMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 20, 2003·3 cites·6 claims
- 0848US6500683B1Method of measuring trench depth of semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 31, 2002·7 cites·7 claims
- 0943US6753573B2Semiconductor device having complementary MOS transistorRENESAS TECH CORP·Filed 2003·Granted Jun 22, 2004·2 cites·3 claims
- 1036US2004178477A1Semiconductor waferRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 1133US2003115177A1Process failure information management systemMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →