Inventor · disambiguated record
Mao Narita
Also filed as: NARITA MAO
0 granted patents·10 pending applications·0 citations·filing 2019–2024
Top patents by PatentIndex Score
10 records- 0158US2024402603A1Photosensitive resin composition, photosensitive element, and method for producing layered bodyRESONAC CORP·Filed 2022·Application pending·0 cites
- 0256US2025390018A1Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing circuit boardRESONAC CORP·Filed 2024·Application pending·0 cites
- 0353US2025267799A1Method for manufacturing wiring board, method for evaluating resist layer or wiring board, and wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0451US2025390020A1Photosensitive resin composition, photosensitive element, cured product, method for forming resist pattern, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2024·Application pending·0 cites
- 0551US2023161248A1Photosensitive film, photosensitive element, and method for producing laminateSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 0650US2024341039A1Method for manufacturing wiring board, and wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0747US2024015889A1Method for producing wiring board, and wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 0842US2025344324A1Pattern formation method and pattern formation structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 0938US2022267484A1Photosensitive resin composition, photosensitive resin film, method for producing cured product, laminate, and electronic componentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 1036US2024111211A1Photosensitive resin film, resist pattern forming method, and wiring pattern forming methodSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →