Inventor · disambiguated record
Manish Nayini
Also filed as: NAYINI MANISH
3 granted patents·4 pending applications·6 citations·filing 2019–2024
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0184US11682646B2IC chip package with dummy solder structure under corner, and related methodMARVELL ASIA PTE LTD·Filed 2021·Granted Jun 20, 2023·1 cites·7 claims
- 0284US11171104B2IC chip package with dummy solder structure under corner, and related methodMARVELL INT LTD·Filed 2019·Granted Nov 9, 2021·4 cites·18 claims
- 0381US11810832B2Heat sink configuration for multi-chip moduleMARVELL ASIA PTE LTD·Filed 2021·Granted Nov 7, 2023·1 cites·12 claims
- 0457US2025014959A1Microelectronic devices including recesses in an encapsulant material and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0552US2023260871A1Three-Dimensional Device Package with Vertical Heat PipesMARVELL ASIA PTE LTD·Filed 2023·Application pending·0 cites
- 0652US2023197635A1Stiffener ring for packages with micro-cable/optical connectorsMARVELL ASIA PTE LTD·Filed 2022·Application pending·0 cites
- 0751US2023035100A1heat dissipation and electrical robustness in a three-dimensional package of stacked integrated circuitsMARVELL ASIA PTE LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →