Inventor · disambiguated record
Matthew D. Neely
Also filed as: NEELY MATTHEW D · NEELY MATTHEW DOUGLAS
1 granted patent·3 pending applications·0 citations·filing 2016–2024
3Inventor score
Top patents by PatentIndex Score
4 records- 0151US2024188217A1Systems and methods for forming stubless plated through holes having wrapping structures in printed circuit boardsTTM TECH INC·Filed 2024·Application pending·0 cites
- 0239US12262464B2Methods for forming engineered thermal paths of printed circuit boards by use of removable layersTTM TECH INC·Filed 2021·Granted Mar 25, 2025·0 cites·17 claims
- 0335US2022053641A1Systems and methods for removing undesired metal within vias from printed circuit boardsTTM TECH INC·Filed 2021·Application pending·0 cites
- 0422US2018156841A1Structure and Method of Making Circuitized Substrate AssemblyI3 ELECTRONICS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →