Inventor · disambiguated record
Mamoru Niishiro
Also filed as: NIISHIRO MAMORU
4 granted patents·255 citations·filing 1991–1996
81Inventor score
Files withFUJITSU LTD4
Top patents by PatentIndex Score
4 records- 0191US5828128ASemiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor deviceFUJITSU LTD·Filed 1996·Granted Oct 27, 1998·160 cites·3 claims
- 0272US5760469ASemiconductor device and semiconductor device mounting boardFUJITSU LTD·Filed 1996·Granted Jun 2, 1998·46 cites·23 claims
- 0364US5413164AHeating furnace in combination with electronic circuit modulesFUJITSU LTD·Filed 1991·Granted May 9, 1995·40 cites·3 claims
- 0434US5337467AMethod of producing wire-bonded substrate assemblyFUJITSU LTD·Filed 1991·Granted Aug 16, 1994·9 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →