Inventor · disambiguated record
Masaya Nishiyama
Also filed as: NISHIYAMA MASAYA
6 granted patents·4 pending applications·147 citations·filing 2001–2016
82Inventor score
Top patents by PatentIndex Score
10 records- 0192US6786945B2Polishing compound and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2002·Granted Sep 7, 2004·83 cites·44 claims
- 0284US7070670B2Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2001·Granted Jul 4, 2006·46 cites·42 claims
- 0376US9299573B2Polishing methodHITACHI CHEMICAL CO LTD·Filed 2013·Granted Mar 29, 2016·4 cites·17 claims
- 0465US7374474B2Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMPHITACHI CHEMICAL CO LTD·Filed 2002·Granted May 20, 2008·14 cites·15 claims
- 0548US2010001229A1Cmp slurry for silicon filmHITACHI CHEMICAL CO LTD·Filed 2009·Application pending·0 cites
- 0643US2007175104A1Polishing slurry for silicon oxide, additive liquid and polishing methodHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 0742US10946494B2Polishing agent, stock solution for polishing agent, and polishing methodHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 16, 2021·0 cites·19 claims
- 0842US10119049B2Polishing agent, storage solution for polishing agent and polishing methodHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 6, 2018·0 cites·12 claims
- 0941US2008200032A1Polishing method of semiconductor substrateHITACHI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 1036US2006199473A1Polishing pad, process for producing the same and method of polishing therewithSUZUKI MASAO·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →