Inventor · disambiguated record
Masaru Nonomura
Also filed as: NONOMURA MASARU
18 granted patents·10 pending applications·211 citations·filing 1997–2020
93Inventor score
Files withNONOMURA MASARU14PANASONIC CORP4MIZUKAMI TATSUHIRO3ABE SEIKOU2MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2
Top patents by PatentIndex Score
28 records- 0195US8668836B2Plasma processing device and method of monitoring plasma discharge state in plasma processing deviceMIZUKAMI TATSUHIRO·Filed 2008·Granted Mar 11, 2014·99 cites·1 claims
- 0281US8237367B2Plasma treatment apparatus and plasma treatment methodNONOMURA MASARU·Filed 2008·Granted Aug 7, 2012·8 cites·3 claims
- 0380US8614118B2Component bonding method, component laminating method and bonded component structureHAJI HIROSHI·Filed 2007·Granted Dec 24, 2013·11 cites·6 claims
- 0478US8558460B2Plasma processing apparatusNONOMURA MASARU·Filed 2010·Granted Oct 15, 2013·4 cites·6 claims
- 0576US9048177B2Resin coating device, and resin coating methodABE SEIKOU·Filed 2012·Granted Jun 2, 2015·4 cites·2 claims
- 0673US8450933B2Plasma processing apparatusNONOMURA MASARU·Filed 2010·Granted May 28, 2013·2 cites·2 claims
- 0770US9040314B2Resin coating device, and resin coating methodABE SEIKOU·Filed 2012·Granted May 26, 2015·4 cites·5 claims
- 0870US8585862B2Plasma processing device and plasma discharge state monitoring deviceMIZUKAMI TATSUHIRO·Filed 2008·Granted Nov 19, 2013·4 cites·9 claims
- 0970US6120585AReflow soldering deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Sep 19, 2000·34 cites·12 claims
- 1068US8855949B2Plasma processing device and method of monitoring discharge state in plasma processing deviceNONOMURA MASARU·Filed 2009·Granted Oct 7, 2014·2 cites·2 claims
- 1164US9326385B2LED package manufacturing system and resin coating method in LED package manufacturing systemNONOMURA MASARU·Filed 2011·Granted Apr 26, 2016·2 cites·6 claims
- 1264US6600137B1Heating device and heating methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jul 29, 2003·28 cites·55 claims
- 1363US8525217B2Method and device for resin coatingNISHIWAKI KENTARO·Filed 2012·Granted Sep 3, 2013·3 cites·10 claims
- 1451US7549566B2Method, apparatus and program of thermal analysis, heat controller and heating furnace using the methodPANASONIC CORP·Filed 2003·Granted Jun 23, 2009·6 cites·4 claims
- 1549US8956499B2Plasma processing deviceMIZUKAMI TATSUHIRO·Filed 2008·Granted Feb 17, 2015·0 cites·5 claims
- 1647US2022336196A1Abnormality determination system and abnormality determination method for plasma treatmentPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1741US2011272098A1Plasma processing apparatusPANASONIC CORP·Filed 2010·Application pending·0 cites
- 1840US9147617B2Resin coating device and a resin coating methodNONOMURA MASARU·Filed 2012·Granted Sep 29, 2015·0 cites·8 claims
- 1940US2013288404A1Light emitting element manufacturing system and manufacturing method and light emitting element package manufacturing system and manufacturing methodNONOMURA MASARU·Filed 2012·Application pending·0 cites
- 2039US8993353B2LED package manufacturing system and resin coating method for use in LED package manufacturing systemNONOMURA MASARU·Filed 2012·Granted Mar 31, 2015·0 cites·8 claims
- 2139US2013330480A1Liquid-application device and liquid-application methodNONOMURA MASARU·Filed 2012·Application pending·0 cites
- 2239US2013330479A1Liquid-application device and liquid-application methodNONOMURA MASARU·Filed 2012·Application pending·0 cites
- 2338US9324906B2LED package manufacturing systemNONOMURA MASARU·Filed 2011·Granted Apr 26, 2016·0 cites·4 claims
- 2438US2013000554A1Resin coating device in led package manufacturing systemPANASONIC CORP·Filed 2011·Application pending·0 cites
- 2538US2013008377A1Resin coating device in led package manufacturing systemPANASONIC CORP·Filed 2011·Application pending·0 cites
- 2637US2012204793A1Led package manufacturing systemNONOMURA MASARU·Filed 2011·Application pending·0 cites
- 2737US2005266618A1Plasma processing method and method for fabricating electronic component module using the sameNONOMURA MASARU·Filed 2005·Application pending·0 cites
- 2837US2013210174A1Resin coating device and resin coating methodNONOMURA MASARU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →