Inventor · disambiguated record
Maurice Heathcote Norcott
Also filed as: NORCOTT MAURICE · NORCOTT MAURICE H · NORCOTT MAURICE HEATHCOTE
27 granted patents·55 pending applications·4,030 citations·filing 1992–2009
98Inventor score
Top patents by PatentIndex Score
82 records- 0199US6334247B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1997·Granted Jan 1, 2002·277 cites·80 claims
- 0299US5821763ATest probe for high density integrated circuits, methods of fabrication thereof and methods of use thereofIBM·Filed 1996·Granted Oct 13, 1998·349 cites·13 claims
- 0399US5635846ATest probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformerIBM·Filed 1993·Granted Jun 3, 1997·342 cites·7 claims
- 0499US5371654AThree dimensional high performance interconnection packageIBM·Filed 1992·Granted Dec 6, 1994·503 cites·25 claims
- 0598US6300780B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1998·Granted Oct 9, 2001·197 cites·17 claims
- 0698US5531022AMethod of forming a three dimensional high performance interconnection packageIBM·Filed 1994·Granted Jul 2, 1996·328 cites·15 claims
- 0797US6541356B2Ultimate SIMOXIBM·Filed 2001·Granted Apr 1, 2003·124 cites·38 claims
- 0897US6332270B2Method of making high density integral test probeIBM·Filed 1998·Granted Dec 25, 2001·231 cites·12 claims
- 0997US6062879AHigh density test probe with rigid surface structureIBM·Filed 1998·Granted May 16, 2000·150 cites·7 claims
- 1097US5810607AInterconnector with contact pads having enhanced durabilityIBM·Filed 1995·Granted Sep 22, 1998·244 cites·18 claims
- 1197US5785538AHigh density test probe with rigid surface structureIBM·Filed 1996·Granted Jul 28, 1998·147 cites·17 claims
- 1296US7538565B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1999·Granted May 26, 2009·112 cites·40 claims
- 1396US5811982AHigh density cantilevered probe for electronic devicesIBM·Filed 1996·Granted Sep 22, 1998·310 cites·13 claims
- 1495US6722032B2Method of forming a structure for electronic devices contact locationsIBM·Filed 2001·Granted Apr 20, 2004·79 cites·16 claims
- 1594US6329827B1High density cantilevered probe for electronic devicesIBM·Filed 1998·Granted Dec 11, 2001·107 cites·22 claims
- 1693US6286208B1Interconnector with contact pads having enhanced durabilityIBM·Filed 1996·Granted Sep 11, 2001·124 cites·5 claims
- 1792US5914614AHigh density cantilevered probe for electronic devicesIBM·Filed 1997·Granted Jun 22, 1999·130 cites·8 claims
- 1891US6104201AMethod and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltageIBM·Filed 1998·Granted Aug 15, 2000·82 cites·10 claims
- 1988US5838160AIntegral rigid chip test probeIBM·Filed 1996·Granted Nov 17, 1998·99 cites·5 claims
- 2081US6486037B2Control of buried oxide quality in low dose SIMOXIBM·Filed 2001·Granted Nov 26, 2002·26 cites·39 claims
- 2172US7276919B1High density integral test probeIBM·Filed 1996·Granted Oct 2, 2007·35 cites·10 claims
- 2267US6717217B2Ultimate SIMOXIBM·Filed 2003·Granted Apr 6, 2004·11 cites·10 claims
- 2366US7332922B2Method for fabricating a structure for making contact with a deviceIBM·Filed 2005·Granted Feb 19, 2008·2 cites·9 claims
- 2462US6756639B2Control of buried oxide quality in low dose SIMOXIBM·Filed 2002·Granted Jun 29, 2004·8 cites·13 claims
- 2561US6784072B2Control of buried oxide in SIMOXIBM·Filed 2002·Granted Aug 31, 2004·9 cites·17 claims
- 2660US6880245B2Method for fabricating a structure for making contact with an IC deviceIBM·Filed 2003·Granted Apr 19, 2005·4 cites·10 claims
- 2758US2010045318A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2009·Application pending·0 cites
- 2858US2010045320A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2009·Application pending·0 cites
- 2958US2010052715A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2009·Application pending·0 cites
- 3058US2010045321A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2009·Application pending·0 cites
- 3158US2010045266A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2009·Application pending·0 cites
- 3258US2009315579A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2009·Application pending·0 cites
- 3358US2010045317A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2009·Application pending·0 cites
- 3458US2010045324A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2009·Application pending·0 cites
- 3556US2008112148A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 3656US2008116912A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 3756US2008112146A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 3856US2008117612A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 3956US2008100317A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4056US2008106285A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4156US2008123310A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4256US2008047741A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4356US2008116916A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4456US2008111569A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4556US2008129319A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4656US2008048691A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4756US2008106282A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4856US2008100316A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 4956US2008112147A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
- 5056US2008116914A1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 2007·Application pending·0 cites
Showing the top 50 of 82 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →